B384T120T30

Not Recommended for New Designs - Replaced by BCM384x120y300A00 B384F120T30 TM BCM Bus Converter TM 384 V to 12 V VI Chip Converter Typical efficiency 95% 300 Watt (450 Watt for 1 ms) 125C operation (T ) J 3 High density up to 1017 W/in <1 s transient response Vin = 360 - 400 V 2 Small footprint 260 W/in >3.5 million hours MTBF Vout = 11.3 - 12.5 V Iout = 25 A Low weight 0.5 oz (15 g) No output filtering required K = 1/32 ZVS / ZCS isolated sine Rout = 20.0 m max amplitude converter Product Description Absolute Maximum Ratings The VI Chip bus converter is a high efficiency (>95%), Parameter Values Unit Notes TM TM narrow input range Sine Amplitude Converter (SAC ) -1.0 to 440 Vdc +In to -In operating from a 360 to 400 Vdc primary bus to deliver 500 Vdc For 100 ms an isolated low voltage secondary (ELV). PC to -In -0.3 to 7.0 Vdc The off-line BCM provides an isolated 11.3 -12.5 V +Out to -Out -0.5 to 16.0 Vdc distribution bus and is ideal for use in silver boxes and Isolation voltage 4242 Vdc Input to Output PFC front ends. Due to the fast response time and low noise of the BCM, the need for limited life aluminum Output current 27.7 A Continuous electrolytic or tantalum capacitors at the input of POL Peak output current 37.5 A For 1 ms converters is reducedor eliminatedresulting in Output power 300 W Continuous savings of board area, materials and total system cost. Peak output power 450 W For 1 ms 3 The BCM achieves a power density of 1017 W/in in 225 C MSL 5 Case temperature a VI Chip package compatible with standard pick-and- 245 C MSL 6 place and surface mount assembly processes. The (1) Operating junction temperature -40 to 125 C T-Grade VI Chip package provides flexible thermal management Storage temperature -40 to 125 C T-Grade through its low junction-to-case and junction-to-board thermal resistance. Owing to its high conversion Note: (1) The referenced junction is defined as the semiconductor having the highest temperature. efficiency and safe operating temperature range, the This temperature is monitored by a shutdown comparator. BCM does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures Part Numbering and long life in the harshest environments. B 384 F 120 T 30 Output Voltage Output Power Bus Converter Input Voltage Designator Designator Module Designator (=VOUT x10) (=POUT/10) Configuration Product Grade Temperatures (C) Grade Storage Operating (T ) F = J-lead J T -40 to125 -40 to125 T = Through hole vicorpower.com800-735-6200 VI Chip Bus Converter B384F120T30 Rev. 2.4 Page 1 of 12Not Recommended for New Designs - Replaced by BCM384x120y300A00 Specifications Input (Conditions are at 384 Vin, full load, and 25C ambient unless otherwise specified) Parameter Min Typ Max Unit Note Input voltage range 360 384 400 Vdc Input dV/dt 1 V/s Input undervoltage turn-on 320 Vdc Input undervoltage turn-off 280 Vdc Input overvoltage turn-on 400 Vdc Input overvoltage turn-off 440 Vdc Input quiescent current 1.1 mA PC low Inrush current overshoot 0.28 A Using test circuit in Figure 20 See Figure 1 Input current 0.9 Adc Input reflected ripple current 456 mA p-p Using test circuit in Figure 20 See Figure 4 No load power dissipation 5.8 8.3 W Internal input capacitance 0.2 F Internal input inductance 5 nH Recommended external input capacitance 2.2 F 200 nH maximum source inductance See Figure 20 Input Waveforms Figure 1 Inrush transient current at full load and 384 Vin with PC Figure 2 Output voltage turn-on waveform with PC enabled at full load enabled and 384 Vin Figure 3 Output voltage turn-on waveform with input turn-on at full Figure 4 Input reflected ripple current at full load and 384 Vin load and 384 Vin vicorpower.com800-735-6200 VI Chip Bus Converter B384F120T30 Rev. 2.4 Page 2 of 12