The VLMS1300-GS08 is a high-density vertical low-profile surface-mount chip-scale package (VLP CSP) from Vishay. This package utilizes thin plastic tape and reel for placement of components. It has a diameter of 4.4 x 4.4 mm and a 0.6 mm profile to enable space savings and height profile reduction for application flexibility. The VLMS1300-GS08 supports the integration of dense, single-die packages. The package utilizes the latest advances in a variety of semiconductor device packages, including high-power devices, providing affordability, scalability, and small form-factor while also offering design flexibility. Due to its size, the VLMS1300-GS08 can be used in a variety of mobile and IoT devices, allowing for an even smaller form-factor. The package also features excellent thermal and electrical characteristics.