Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the T series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The S series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring electrical isolation from the electronic device. All options other than -T1 and -T4 are RoHS compliant. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2 x 2 piece of T4 has a resistance of 1.10 C-in 2/W 4 in 2=0.275 C/W T SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Manufacturer Thermal Impedance Thickness, Suffix Product C-in 2/W Inches Package Surface, Comments -T1 Chomerics, T405 0.47 0.006 Metal/ceramic aluminum carrier -T1E Chomerics, T405R 0.47 0.006 RoHS-compliant version of -T1 -T3 Chomerics, T412 0.25 0.009 Metal/ceramic very good performance and conformity -T4 Chomerics, T410 1.10 0.007 Plastic -T4E Chomerics, T410R 1.10 0.007 RoHS-compliant version of -T4 -T5 Chomerics, T411 1.00 0.011 Plastic conforms to out-of-flat packages -T6 3M, 8810 0.88 0.010 Metal/ceramic very good adhesion and conformity -T7 Bergquist, BP 108 1.28 0.008 Metal/ceramic electrically insulating S SERIES THERMAL INTERFACE PADS Manufacturer Thermal Impedance Thickness, Suffix Product C-in 2/W Inches Package Surface, Comments -S4 Berquist Softface 0.06 0.005 All surfaces requires mechanical fasteners ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To order the 658 Series heat sink at .350 tall with the T5 thermal interface material, specify part number: 658-35AB - T5 From Catalog Page From Table on Page 3Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Omnidirectional Pin Fin Heat Sink for BGAs 624 SERIES Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 624-25AB .827 (21) .250 (6.4) 21mm BGA .009 (4.09) 624-35AB .827 (21) .350 (8.9) 21mm BGA .011 (4.99) 624-45AB .827 (21) .450 (11.4) 21mm BGA .015 (6.81) 624-60AB .827 (21) .600 (15.2) 21mm BGA .026 (11.80) Material: Aluminum, Black Anodized The 624 Series is an omnidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications. Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Applications include network routers and switches, high-resolution printers, Available with pressure sensitive adhesives for quick and easy mounting. digital cameras, consumer video games, digital video disks (DVD) and See Page 3 global positioning systems (GPS). MECHANICAL DIMENSIONS 624 SERIES 624 THERMAL PERFORMANCE 30 624-25-T4 624-35-T4 25 624-45-T4 624-60-T4 20 15 10 5 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. Omnidirectional Pin Fin Heat Sink for BGAs 625 SERIES Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 625-25AB .984 (25) 0.250 (6.4) 25 mm BGA .012 (5.45) 625-35AB .984 (25) 0.350 (8.9) 25 mm BGA .014 (6.36) 625-45AB .984 (25) 0.450 (11.4) 25 mm BGA .018 (8.17) 625-60AB .984 (25) 0.600 (15.2) 25 mm BGA .030 (13.62) Material: Aluminum, Black Anodized The 625 Series is an omnidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications. Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Applications include network routers and switches, high-resolution printers, Available with pressure sensitive adhesives for quick and easy mounting. digital cameras, consumer video games, digital video disks (DVD) and See Page 3 global positioning systems (GPS). MECHANICAL DIMENSIONS 625 SERIES 625 THERMAL PERFORMANCE 20 625-25-T4 18 625-25-T4 625-45-T4 16 625-60-T4 14 12 10 8 6 4 2 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. 4 Case-to-Ambient Thermal Resistance, C/W Case-to-Ambient Thermal Resistance, C/W