901-19-1-12-2-B-0 Wakefield

901-19-1-12-2-B-0 electronic component of Wakefield
901-19-1-12-2-B-0 Wakefield
901-19-1-12-2-B-0 Heat Sinks
901-19-1-12-2-B-0  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of 901-19-1-12-2-B-0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. 901-19-1-12-2-B-0 Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. 901-19-1-12-2-B-0
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 11.6mm Height, Aluminum
Datasheet: 901-19-1-12-2-B-0 Datasheet (PDF)
Price (USD)
1: USD 8.2656 ea
Line Total: USD 8.27 
Availability : 257
  
Ship by Wed. 19 Nov to Fri. 21 Nov
QtyUnit Price
1$ 8.2656
10$ 6.8145
25$ 6.5604
50$ 6.237
90$ 6.006
270$ 5.879
540$ 5.7519
1080$ 5.7519

Availability 257
Ship by Wed. 19 Nov to Fri. 21 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 8.2656
10$ 6.8145
25$ 6.5604
50$ 6.237
90$ 6.006
270$ 5.879
540$ 5.7519
1080$ 5.7519


Availability 4
Ship by Wed. 19 Nov to Fri. 21 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 9.4962
3$ 7.7028
8$ 7.2912
25$ 7.2765

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the 901-19-1-12-2-B-0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 901-19-1-12-2-B-0 and other electronic components in the Heat Sinks category and beyond.

Image Part-Description
Stock Image 901-19-2-23-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 902-21-1-12-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 11.6mm Height, Aluminum
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 23mm Chip Size, 14.6mm Height, Aluminum
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Stock Image 901-19-2-12-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 19mm Chip Size, 11.6mm Height, Aluminum
Stock : 35
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 902-21-2-12-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 11.6mm Height, Aluminum
Stock : 90
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 902-21-2-23-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 22.6mm Height, Aluminum
Stock : 5
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 901-19-1-23-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 22.6mm Height, Aluminum
Stock : 127
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 904-27-1-12-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum
Stock : 180
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 902-21-1-23-2-B-0
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 22.6mm Height, Aluminum
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 903-23-1-12-2-B-0
Heatsink: extruded; grilled; BGA; black; L: 23mm; W: 23mm; H: 11.6mm
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image 4005G
Thermal Interface Products Thermal Pad, TO5, Round, Beryllium Oxide Ceramic, 9.14x5.08x 0.762mm
Stock : 834
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 4003G
Thermal Interface Products Thermal Pad, TO3, Rhombus, Beryllium Oxide Ceramic, 39.65x26.67x 1.575mm
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 392-300AB
Heat Sinks Heat Sink for Power Modules, IGBTs and Solid State Relays, Aluminum, 300mm
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 392-180AB
Heat Sinks Heat Sink for Power Modules, IGBTs and Solid State Relays, Aluminum, 180mm
Stock : 108
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 375324B00035G
Heat Sinks Heat Sink for Plastic BGA Packages, Black Anodized, 10.2x10.2x10.2mm, IC Pkg Size = 10 x 10, Tape #35
Stock : 1430
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 375124B60024G
Heat Sinks BGA Solder Anchor, 40x40x25mm, Black Anodized, 2 Anchors, IC Pkg Size = 42 x 40
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 374924B00032G
Heat Sinks Heat Sink, Metal/Ceramic BGA Packages, 40x40x10mm, IC Size=40x40, Tape #32
Stock : 1096
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 374724B60024G
Heat Sinks 35mm x 35mm x 18mm SOLDER ANCHOR MOUNT
Stock : 41
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 374724B00032G
Heat Sinks Heat Sink, Metal/Ceramic BGA Packages, 35x35x18mm, IC Size=35x35, Tape #32
Stock : 1888
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image 374624B00035G
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x10mm, IC Size=35x35, Tape #35
Stock : 1951
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc
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