901-19-1-12-2-B-0 Wakefield

901-19-1-12-2-B-0 electronic component of Wakefield
901-19-1-12-2-B-0 Wakefield
901-19-1-12-2-B-0 Heat Sinks
901-19-1-12-2-B-0 Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of 901-19-1-12-2-B-0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. 901-19-1-12-2-B-0 Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. 901-19-1-12-2-B-0
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 11.6mm Height, Aluminum
Datasheet: 901-19-1-12-2-B-0 Datasheet (PDF)
Price (USD)
1: USD 9.4962 ea
Line Total: USD 9.5 
Availability : 4
  
Ship by Wed. 06 Aug to Fri. 08 Aug
QtyUnit Price
1$ 9.4962
3$ 7.7028
8$ 7.2765

 901-19-1-12-2-B-0 More Buying Options & Price Grid(s)
Availability 4
Ship by Wed. 06 Aug to Fri. 08 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 9.4962
3$ 7.7028
8$ 7.2765

Specifications

   
Manufacturer
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RoHS - XON
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Thermal Resistance
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the 901-19-1-12-2-B-0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 901-19-1-12-2-B-0 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

WAK may also be referenced as

Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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