Wave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly. Features & Benefits Approximately 12% better thermal performance than traditional footprint heat sinks Height- A low profile design allows for more surface area in a height restricted application Clipping mechanism included with heat sink Surface Area- Fin array allows for more surface area for forced convection Easily customizable Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc. Material Specifications Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish. Spring Clip: 304 Stainless Steel, 1.2mm 0.47 DIA RoHS Compliant Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-165 Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 WAVE-32-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 32 32 50.2 12 10957.5 10 4.64 WAVE-34-21 Spring-Anchor 34 34 70 21 21268.4 19 2.19 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-12 Spring-Anchor 35 35 62 12 15180.8 10 3.83 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-125 Spring-Anchor 35 35 63.3 12.5 15792.6 10.5 3.63 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-15 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 58.1 15 15612.7 13 3.15 WAVE-35-21 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 74.6 21 21721.8 19 2.11 WAVE-366-175 Spring-Anchor 36.6 36.6 63.6 17.5 18637.8 15.5 2.55 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-12 Spring-Anchor 40 40 66.9 12 17689.4 10 3.36 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-125 Spring-Anchor 40 40 68.3 12.5 18410.1 10.5 3.16 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-425-117 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 42.5 42.5 67.4 11.7 21668.3 9.3 3.40 WAVE-45-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 45 45 72 12 22303.7 10 2.96 WAVE-ANC1 ANCHOR, PCB, 10MM TALL WAVE-ANC2 ASSEMBLY , SOLDER ANCHORWave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks Wave 2x Series Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 WAVE-23-165 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-125 WAVE-23-165