W25M121AVEITS Winbond

Name: W25M121AVEITS
Brand: Winbond
SKU: W25M121AVEITS_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W25M121AVEITS electronic component of Winbond

Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25M121AVEITS Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M121AVEITS Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

Part No.	W25M121AVEITS
Manufacturer:	Winbond
Category:	Multichip Packages
Description:	Multichip Packages
Datasheet:	W25M121AVEITS Datasheet (PDF)

Price (USD)

480: USD 4.345 ea
Line Total: USD 2085.6

Availability : 0

Qty	Unit Price
480	$ 4.345
500	$ 4.114
1000	$ 4.07

W25M121AVEITS More Buying Options & Price Grid(s)

Availability

Price (USD)

Quantity

Availability 0

Ship by Wed. 13 Aug to Fri. 15 Aug

MOQ : 480
Multiples : 480

Qty	Unit Price
480	$ 4.345
500	$ 4.114
1000	$ 4.07

Specifications

Manufacturer Winbond Winbond
Product Category Multichip Packages Multichip Packages

We are delighted to provide the W25M121AVEITS from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M121AVEITS and other electronic components in the Multichip Packages category and beyond.

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Additional Infomation About Product

W25M121AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 128M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: August 21, 2017 Preliminary Revision A W25M121AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET ........................................................................................................................ 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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