Product Information

W25Q256JVFIM

W25Q256JVFIM electronic component of Winbond

Datasheet
NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector, DTR

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.7471 ea
Line Total: USD 2.75

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 176
Multiples : 1

Stock Image

W25Q256JVFIM
Winbond

176 : USD 3.549
250 : USD 3.5162
500 : USD 3.4847
1000 : USD 3.4519
2000 : USD 3.4204
2500 : USD 3.3876
3000 : USD 3.3547
4000 : USD 3.3219
5000 : USD 3.2891
10000 : USD 3.2576

0 - WHS 2


Ships to you between Tue. 14 May to Mon. 20 May

MOQ : 176
Multiples : 1

Stock Image

W25Q256JVFIM
Winbond

176 : USD 3.549
250 : USD 3.5162
500 : USD 3.4847
1000 : USD 3.4519
2000 : USD 3.4204
2500 : USD 3.3876
3000 : USD 3.3547
4000 : USD 3.3219
5000 : USD 3.2891
10000 : USD 3.2576

0 - WHS 3


Ships to you between Mon. 20 May to Wed. 22 May

MOQ : 1
Multiples : 1

Stock Image

W25Q256JVFIM
Winbond

1 : USD 5.5078
10 : USD 3.8896
25 : USD 3.8367
100 : USD 3.4133
220 : USD 3.1676
440 : USD 3.1549
1100 : USD 2.9386
2640 : USD 2.8877
5060 : USD 2.7224

     
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RoHS - XON
Icon ROHS
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W25Q256JV-DTR 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: October 25, 2016 - Revision C W25Q256JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 3-Byte / 4-Byte Address Modes ............................................................................................ 12 6.1.7 Hold Function ....................................................................................................................... 13 6.1.8 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 15 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 16 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 16 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 16 7.1.6 Status Register Protect/Lock (SRP, SRL) Volatile/Non-Volatile Writable ...................... 16 7.1.7 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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