W25Q32JWSSIM Winbond

W25Q32JWSSIM electronic component of Winbond
W25Q32JWSSIM Winbond
W25Q32JWSSIM NOR Flash
W25Q32JWSSIM  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q32JWSSIM NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q32JWSSIM NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q32JWSSIM
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 1.8V, 32M-bit, 4Kb Uniform Sector, DTR
Datasheet: W25Q32JWSSIM Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 360
Multiples : 90
QtyUnit Price
360$ 0.8974
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.4105
10$ 1.0593
100$ 0.8957
500$ 0.8441
810$ 0.8103
2430$ 0.7632
5670$ 0.7379
10530$ 0.7123
25110$ 0.6856
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the W25Q32JWSSIM from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q32JWSSIM and other electronic components in the NOR Flash category and beyond.

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W25Q32JW DTR 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: September 04, 2018 - Revision G W25Q32JW DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil ................................................................. 5 3.2 Pad Configuration WSON 6x5-mm & XSON 4x4-mm, USON 4x3-mm ............................... 5 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm, XSON 4x4-mm, USON 4x3-mm . 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 6 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 6 3.7 Ball Configuration WLCSP ................................................................................................... 7 3.8 Ball Description WLCSP12 ................................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 4.3 Write Protect (/WP) ............................................................................................................... 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 4.6 Reset (/RESET) .................................................................................................................... 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 Standard SPI Instructions ..................................................................................................... 10 Dual SPI Instructions ............................................................................................................ 10 Quad SPI Instructions ........................................................................................................... 11 QPI Instructions .................................................................................................................... 11 SPI / QPI DTR Read Instructions .......................................................................................... 11 Hold Function ........................................................................................................................ 11 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 Write Protect Features .......................................................................................................... 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 Erase/Write In Progress (BUSY) Status Only ................................................................. 14 Write Enable Latch (WEL) Status Only ........................................................................... 14 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 14 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 15 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 15 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 Status Register Protect (SRP, SRL) ..................................................................................... 16 Erase/Program Suspend Status (SUS) Status Only ....................................................... 17 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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