W25X40CLSVIG Winbond

W25X40CLSVIG electronic component of Winbond
W25X40CLSVIG Winbond
W25X40CLSVIG NOR Flash
W25X40CLSVIG  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25X40CLSVIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25X40CLSVIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25X40CLSVIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 2.5V/3.3V 4M-bit 512K x 8 8ns 8-Pin SOIC
Datasheet: W25X40CLSVIG Datasheet (PDF)
Price (USD)
1: USD 0.9341 ea
Line Total: USD 0.93 
Availability : 30
  
Ship by Fri. 21 Nov to Thu. 27 Nov
QtyUnit Price
1$ 0.9341
10$ 0.9108
30$ 0.6698
100$ 0.5931

Availability 30
Ship by Fri. 21 Nov to Thu. 27 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.9341
10$ 0.9108
30$ 0.6698
100$ 0.5931

   
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We are delighted to provide the W25X40CLSVIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25X40CLSVIG and other electronic components in the NOR Flash category and beyond.

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W25X40CL 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: March 25, 2014 - 1 - Revision F W25X40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5 4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 6. PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7 6.4 Write Protect (/WP) ......................................................................................................... 7 6.5 HOLD (/HOLD) ................................................................................................................ 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 7. BLOCK DIAGRAM ...................................................................................................................... 8 7.1 SPI OPERATIONS.......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Reserved Bits ................................................................................................................. 12 8.1.6 Status Register Protect (SRP) ........................................................................................ 12 8.1.7 Status Register Memory Protection ................................................................................ 13 8.2 INSTRUCTIONS ........................................................................................................... 14 8.2.1 Manufacturer and Device Identification .......................................................................... 14 (1) 8.2.2 Instruction Set ............................................................................................................. 15 8.2.3 Write Enable (06h) .......................................................................................................... 16 8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 16 8.2.5 Write Disable (04h) ......................................................................................................... 17 8.2.6 Read Status Register (05h) ............................................................................................ 17 8.2.7 Write Status Register (01h) ............................................................................................ 18 8.2.8 Read Data (03h) ............................................................................................................. 19 8.2.9 Fast Read (0Bh) ............................................................................................................. 20 8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 21 8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 22 8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 24 8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 8.2.14 Page Program (02h) ..................................................................................................... 25 8.2.15 Sector Erase (20h) ....................................................................................................... 26 Publication Release Date: March 25, 2014 - 2 - Revision F

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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