Product Information

W25X40CLSVIG

W25X40CLSVIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 2.5V/3.3V 4M-bit 512K x 8 8ns 8-Pin SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

480: USD 0.3198 ea
Line Total: USD 153.5

0 - Global Stock
MOQ: 480  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 480
Multiples : 1

Stock Image

W25X40CLSVIG
Winbond

480 : USD 0.3198
500 : USD 0.3039
1000 : USD 0.3008
2000 : USD 0.2978
2500 : USD 0.2948
3000 : USD 0.2919
4000 : USD 0.2889
5000 : USD 0.2861
10000 : USD 0.2832
20000 : USD 0.2804

0 - WHS 2


Ships to you between Mon. 13 May to Wed. 15 May

MOQ : 28000
Multiples : 28000

Stock Image

W25X40CLSVIG
Winbond

28000 : USD 0.3248
56000 : USD 0.3079

     
Manufacturer
Product Category
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W29GL128CH9C electronic component of Winbond W29GL128CH9C

NOR Flash Parallel 3V 128M-bit 8M x 16 90ns
Stock : 171

W29GL128CH9B electronic component of Winbond W29GL128CH9B

NOR Flash Parallel 3V/3.3V 128M-bit 128M x 1 100ns 48-Pin LFBGA
Stock : 151

W29GL064CL7T electronic component of Winbond W29GL064CL7T

NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 56-Pin TSOP
Stock : 0

W29GL032CL7B electronic component of Winbond W29GL032CL7B

NOR Flash Parallel 3V/3.3V 32M-bit 4M x 8/2M x 16 70ns 64-Pin LFBGA
Stock : 0

W29GL032CB7S electronic component of Winbond W29GL032CB7S

FLASH FLASH 32Mb (4M x 8, 2M x 16) Parallel TSOP-48 RoHS
Stock : 0

W25X80VZPIG electronic component of Winbond W25X80VZPIG

Winbond Electronics Corporation
Stock : 14

W25X40CLUXIG TR electronic component of Winbond W25X40CLUXIG TR

NOR Flash spiFlash, 4M-bit, 4Kb Uniform Sector
Stock : 6423

W25X40CLZPIG electronic component of Winbond W25X40CLZPIG

NOR Flash Serial-SPI 2.5V/3.3V 4M-bit 512K x 8 8ns 8-Pin WSON EP
Stock : 0

W29GL064CB7S electronic component of Winbond W29GL064CB7S

FLASH FLASH 64Mb (8M x 8, 4M x 16) Parallel TSOP-48 RoHS
Stock : 0

W29GL064CT7S electronic component of Winbond W29GL064CT7S

NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TSOP
Stock : 0

Image Description
XC7A35T-L2CPG236E electronic component of Xilinx XC7A35T-L2CPG236E

FPGA Artix-7 Family 33280 Cells 28nm Technology 0.9V 236-Pin CSBGA
Stock : 0

XC7A35T-L2CSG324E electronic component of Xilinx XC7A35T-L2CSG324E

FPGA Artix-7 Family 33280 Cells 28nm Technology 0.9V 324-Pin CS-BGA
Stock : 0

W2603SYT electronic component of Kingbright W2603SYT

W2603SYT
Stock : 0

XC7A50T-1CSG324I electronic component of Xilinx XC7A50T-1CSG324I

FPGA Artix-7 Family 52160 Cells 28nm Technology 1V 324-Pin CS-BGA
Stock : 0

XC7A50T-1FGG484C electronic component of Xilinx XC7A50T-1FGG484C

FPGA - Field Programmable Gate Array XC7A50T-1FGG484C
Stock : 0

XC7A50T-1FT256I electronic component of Xilinx XC7A50T-1FT256I

FPGA Artix-7 52160 Cells 28nm Technology 1V 256-Pin FBGA
Stock : 0

XC7A50T-2CPG236I electronic component of Xilinx XC7A50T-2CPG236I

FPGA Artix-7 Family 52160 Cells 28nm Technology 1V 236-Pin CSBGA
Stock : 0

W2650BLU electronic component of Access Communications W2650BLU

CAT5E PATCH LEAD 0.5M BLUE
Stock : 0

XC7A50T-2CSG325C electronic component of Xilinx XC7A50T-2CSG325C

FPGA Artix-7 Family 52160 Cells 28nm Technology 1V 325-Pin CS-BGA
Stock : 0

W2653YEL electronic component of Access Communications W2653YEL

CAT5E PATCH LEAD 3M YELLOW
Stock : 0

W25X40CL 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: March 25, 2014 - 1 - Revision F W25X40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5 4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 6. PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7 6.4 Write Protect (/WP) ......................................................................................................... 7 6.5 HOLD (/HOLD) ................................................................................................................ 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 7. BLOCK DIAGRAM ...................................................................................................................... 8 7.1 SPI OPERATIONS.......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Reserved Bits ................................................................................................................. 12 8.1.6 Status Register Protect (SRP) ........................................................................................ 12 8.1.7 Status Register Memory Protection ................................................................................ 13 8.2 INSTRUCTIONS ........................................................................................................... 14 8.2.1 Manufacturer and Device Identification .......................................................................... 14 (1) 8.2.2 Instruction Set ............................................................................................................. 15 8.2.3 Write Enable (06h) .......................................................................................................... 16 8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 16 8.2.5 Write Disable (04h) ......................................................................................................... 17 8.2.6 Read Status Register (05h) ............................................................................................ 17 8.2.7 Write Status Register (01h) ............................................................................................ 18 8.2.8 Read Data (03h) ............................................................................................................. 19 8.2.9 Fast Read (0Bh) ............................................................................................................. 20 8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 21 8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 22 8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 24 8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 8.2.14 Page Program (02h) ..................................................................................................... 25 8.2.15 Sector Erase (20h) ....................................................................................................... 26 Publication Release Date: March 25, 2014 - 2 - Revision F

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted