X-On Electronics has gained recognition as a prominent supplier of W29N08GVBIAA NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N08GVBIAA NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

W29N08GVBIAA Winbond

Name: W29N08GVBIAA
Brand: Winbond
SKU: W29N08GVBIAA_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W29N08GVBIAA electronic component of Winbond

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Part No.	W29N08GVBIAA
Manufacturer:	Winbond
Category:	NAND Flash
Description:	NAND Flash 4G-bit NAND flash, 3V x 8bit
Datasheet:	W29N08GVBIAA Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

W29N08GVBIAA More Buying Options & Price Grid(s)

Availability	Price	Quantity
0 MOQ : 210 Multiples : 210	210 : USD 17.3847 630 : USD 17.2871 840 : USD 17.1895 1050 : USD 17.0906 1680 : USD 16.9916 2100 : USD 16.8899 2520 : USD 16.7883 5040 : USD 16.6866 5880 : USD 16.5822 21000 : USD 16.4778	N/A Obsolete

0 MOQ : 1 Multiples : 1	1 : USD 13.0487 10 : USD 11.6025 25 : USD 11.3416 50 : USD 11.2763	N/A Obsolete

We are delighted to provide the W29N08GVBIAA from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N08GVBIAA and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N08GV 2 CHIP STACKED 8G-BIT W29N08GV 8G-BIT 3.3V NAND FLASH MEMORY th Release Date: May 17 , 2018 1 Revision C W29N08GV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin Assignment W29N08GVSIAA 1CE Type 48-pin TSOP1 ............................................... 8 3.2 Pin Assignment W29N08GVSIAD 2CE Type 48-pin TSOP1 ............................................... 9 3.3 Pin Assignment W29N08GVBIAA 1CE Type 63-ball VFBGA ............................................ 10 3.4 Pin Assignment W29N08GVBIAD 2CE Type 63-ball VFBGA ............................................ 11 3.5 Pin Descriptions .................................................................................................................. 12 4. PIN DESCRITPIONS ................................................................................................................... 13 4.1 Chip Enable ( CE) .............................................................................................................. 13 4.2 Write Enable ( WE) ............................................................................................................ 13 4.3 Read Enable ( RE) ............................................................................................................. 13 4.4 Address Latch Enable (ALE) .............................................................................................. 13 4.5 Command Latch Enable (CLE) ........................................................................................... 13 4.6 Write Protect ( WP) ............................................................................................................ 13 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 13 4.8 Input and Output (I/Ox) ....................................................................................................... 13 5. SINGLE DIE BLOCK DIAGRAM .................................................................................................. 14 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 15 6.1 Array Organization ............................................................................................................ 15 7. MODE SELECTION TABLE ........................................................................................................ 16 8. COMMAND TABLE ...................................................................................................................... 17 9. DEVICE OPERATIONS ............................................................................................................... 19 9.1 READ operation .................................................................................................................. 19 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 19 9.1.2 CACHE READ OPERATIONS .............................................................................................. 19 9.1.3 TWO PLANE READ (00h-00h-30h) ...................................................................................... 23 9.1.4 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 25 9.1.5 READ ID (90h) ...................................................................................................................... 27 9.1.6 READ PARAMETER PAGE (ECh) ....................................................................................... 28 9.1.7 READ STATUS (70h) ........................................................................................................... 30 9.1.8 READ STATUS ENHANCED (78h) ...................................................................................... 32 9.1.9 READ UNIQUE ID (EDh) ...................................................................................................... 33 9.2 PROGRAM operation ......................................................................................................... 34 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 34 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 34 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 35 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 35 9.2.5 TWO PLANE PAGE PROGRAM .......................................................................................... 37 9.3 COPY BACK operation ....................................................................................................... 40 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 40 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 40 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 41 th Release Date: May 17 , 2018 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Manufacturer Winbond Winbond
Product Category NAND Flash NAND Flash
RoHS - XON Y Y
Mounting Style Smd/Smt Smd/Smt
Package / Case VFBGA - 63 VFBGA - 63
Series W29n08gv W29n08gv
Memory Size 8 gb it 8 gb it
Interface Type Parallel Parallel
Organisation 1 G X 8 1 G X 8
Data Bus Width 8 bit 8 bit
Supply Voltage - Min 2.7 V 2.7 V
Supply Voltage - Max 3.6 V 3.6 V
Supply Current - Max 35 mA 35 mA
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Tube Tube
Brand Winbond Winbond
Hts Code 8542320051 8542320051
Product Type Nand Flash Nand Flash
Factory Pack Quantity : 210 210
Subcategory Memory & Data Storage Memory & Data Storage