W71NW11GF1EW Winbond

W71NW11GF1EW electronic component of Winbond
W71NW11GF1EW Winbond
W71NW11GF1EW Multichip Packages
W71NW11GF1EW  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W71NW11GF1EW Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W71NW11GF1EW Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

Part No. W71NW11GF1EW
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
Datasheet:
Price (USD)
4500: USD 7.8372 ea
Line Total: USD 35267.4 
Availability : 0
  
QtyUnit Price
4500$ 7.8372
45000$ 7.6595
450000$ 6.6213
2250000$ 6.0833
4500000$ 6.0782

Availability 0
Ship by Fri. 15 Aug to Thu. 21 Aug
MOQ : 4500
Multiples : 1
QtyUnit Price
4500$ 7.8372
45000$ 7.6595
450000$ 6.6213
2250000$ 6.0833
4500000$ 6.0782


Availability 0
Ship by Wed. 13 Aug to Fri. 15 Aug
MOQ : 4500
Multiples : 4500
QtyUnit Price
4500$ 7.7501

   
Manufacturer
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W71NW11GF1EW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW11GF1EW and other electronic components in the Multichip Packages category and beyond.

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Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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