X-On Electronics has gained recognition as a prominent supplier of W9825G2JB-6I DRAM across the USA, India, Europe, Australia, and various other global locations. W9825G2JB-6I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W9825G2JB-6I Winbond

W9825G2JB-6I electronic component of Winbond
W9825G2JB-6I Winbond
W9825G2JB-6I DRAM
W9825G2JB-6I  Semiconductors

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See Product Specifications
Part No. W9825G2JB-6I
Manufacturer: Winbond
Category: DRAM
Description: DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA
Datasheet: W9825G2JB-6I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 240
Multiples : 1
240 : USD 12.4858
250 : USD 11.4452
500 : USD 11.3307
1000 : USD 11.1081
2000 : USD 10.9974
2500 : USD 10.888
3000 : USD 10.7786
5000 : USD 10.6705
10000 : USD 10.5637
25000 : USD 10.4682
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 8.8179
10 : USD 7.8186
25 : USD 7.6694
50 : USD 7.6097
100 : USD 6.9532
250 : USD 6.9532
N/A

Obsolete
   
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We are delighted to provide the W9825G2JB-6I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W9825G2JB-6I and other electronic components in the DRAM category and beyond.

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W9825G2JB 2M 4 BANKS 32 BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION ......................................................................................................... 3 2. FEATURES ................................................................................................................................. 3 3. ORDER INFORMATION ............................................................................................................. 3 4. BALL CONFIGURATION ............................................................................................................ 4 5. BALL DESCRIPTION .................................................................................................................. 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 6.1 Block diagram of single chip ........................................................................................... 6 6.2 Block diagram of Dual-Die-Package (DDP) .................................................................... 7 7. FUNCTIONAL DESCRIPTION.................................................................................................... 8 7.1 Power Up and Initialization ............................................................................................. 8 7.2 Programming Mode Register Set command .................................................................. 8 7.3 Bank Activate Command ................................................................................................ 8 7.4 Read and Write Access Modes ...................................................................................... 8 7.5 Burst Read Command .................................................................................................... 9 7.6 Burst Command .............................................................................................................. 9 7.7 Read Interrupted by a Read ........................................................................................... 9 7.8 Read Interrupted by a Write ............................................................................................ 9 7.9 Write Interrupted by a Write ............................................................................................ 9 7.10 Write Interrupted by a Read ............................................................................................ 9 7.11 Burst Stop Command ................................................................................................... 10 7.12 Addressing Sequence of Sequential Mode .................................................................. 10 7.13 Addressing Sequence of Interleave Mode .................................................................... 10 7.14 Auto-precharge Command ........................................................................................... 11 7.15 Precharge Command .................................................................................................... 11 7.16 Self Refresh Command ................................................................................................ 11 7.17 Power Down Mode ....................................................................................................... 12 7.18 No Operation Command ............................................................................................... 12 7.19 Deselect Command ...................................................................................................... 12 7.20 Clock Suspend Mode .................................................................................................... 12 8. OPERATION MODE ................................................................................................................. 13 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 14 9.1 Absolute Maximum Ratings .......................................................................................... 14 9.2 Recommended DC Operating Conditions .................................................................... 14 9.3 Capacitance .................................................................................................................. 14 9.4 DC Characteristics ........................................................................................................ 15 9.5 AC Characteristics and Operating Condition ................................................................ 16 10. TIMING WAVEFORMS ............................................................................................................. 18 10.1 Command Input Timing ................................................................................................ 18 10.2 Read Timing .................................................................................................................. 19 Publication Release Date: Oct. 31, 2017 Revision: A02 - 1 - W9825G2JB 10.3 Control Timing of Input/Output Data ............................................................................. 20 10.4 Mode Register Set Cycle .............................................................................................. 21 11. OPERATINOPERATING TIMING EXAMPLE ........................................................................... 22 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ...................................... 22 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ........... 23 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ...................................... 24 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ........... 25 11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 26 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 27 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) .............................................. 28 11.8 Page Mode Read/Write (Burst Length = 8, CAS Latency = 3) ..................................... 29 11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) ........................................ 30 11.10 Auto-precharge Write (Burst Length = 4) .................................................................... 31 11.11 Auto Refresh Cycle ..................................................................................................... 32 11.12 Self Refresh Cycle ....................................................................................................... 33 11.13 Bust Read and Single Write (Burst Length = 4, CAS Latency = 3) ............................. 34 11.14 Power down Mode ....................................................................................................... 35 11.15 Auto-precharge Timing (Read Cycle) .......................................................................... 36 11.16 Auto-precharge Timing (Write Cycle) .......................................................................... 37 11.17 Timing Chart of Read to Write Cycle ........................................................................... 38 11.18 Timing Chart of Write to Read Cycle ........................................................................... 38 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) .......................................... 39 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) .......................................... 39 11.21 CKE/DQM Input Timing (Write Cycle) ......................................................................... 40 11.22 CKE/DQM Input Timing (Read Cycle) ......................................................................... 41 12. PACKAGE SPECIFICATION .................................................................................................... 42 13. REVISION HISTORY ................................................................................................................ 43 Publication Release Date: Oct. 31, 2017 Revision: A02 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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