82307050029

Spezifikation fr Freigabe / specification for release Kunde / customer : Artikelnummer / part number : 82307050029 Datum / Date : 2006-08-01 Bezeichnung : description : 0402 ESD ULTRA LOW CAP TVS SMD size: 0402 ROHS Compliant A Mechanische Abmessungen / dimensions : SIZE (Unit : mm) SIZE W L T a 0402 0.5 1.0 0.6 0.25 0603 0.8 1.6 0.9 0.3 0805 1.25 2.0 1.2 0.3 1206 1.6 3.2 1.5 0.5 1210 2.5 3.2 1.5 0.5 1812 3.2 4.5 2.0 0.5 2220 5.0 5.7 2.5 0.5 3220 5.0 8.0 1.5 to 2.5 0.8 B Elektrische Eigenschaften / electrical properties : TECHNICAL DATA Working Max. Clamping Trigger Leakage ESD Pulse ESD Voltage Part Number Capacitance Voltage Voltage Voltage Current Withstand air discharge DC V (*1) V A (*2) kV (*3) pF 82307050029 5 17 typ. 100 0.05 >100 +/-15 0.2 * 1 Max. Clamping Voltage at 8/20 waveformand 1 A pulse current Capacitance tolerance: <0.8pF * 2 Leakage Current at max operating voltage, the max leakage current was measured at reliability test Capacitance measured at: 1MHz * 3. ESD Typ. Withstands Voltage design and method guarantee this property Capacitance/Frequency DC to & 1.8 GHz Design and Specifications are subject to change without notice REFERENCE DATA Response time T < 1 ns rise Operating ambientg temperature -40+85 Storage temperature -50+125 Max. temperature solder 260/10s OTHER DATA Body ZnO End termination Ag/Ni/Sn Packaging Reel Complies with Standard IEC61000-4-2 Procedure Solgel Marking None Wrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex department D-74638 Waldenburg Max-Eyth-Strae 1 - 3 Germany Telefon (+49) (0) 7942 - 945 - 0 Telefax (+49) (0) 7942 - 945 - 400 Spezifikation fr Freigabe / specification for release Kunde / customer : Artikelnummer / part number : 82.307.050.029 Bezeichnung : description : 0402 ESD ULTRA LOW CAP TVS SMD size: 0402 C Ltpad / soldering spec. : RECOMMENDED SOLDER PAD LAYOUT (Unit : mm) A SISE A B C D 402 0.4~0.6 1.0~1.8 0.6~0.7 0.6~1.2 603 0.8~1.2 1.7~3.0 1.2~1.6 0.9~1.8 C 805 1.0~1.5 2.1~3.8 1.5~2.1 1.1~2.3 1206 1.8~2.5 3.0~5.8 1.8~2.6 1.2~3.3 1210 1.8~2.5 3.2~6.1 2.8~3.8 1.3~3.5 1812 2.5~3.5 4.0~7.3 3.3~4.5 1.5~3.8 D 2220 3.5~4.6 5.0~8.5 5.2~6.2 1.5~3.9 B 3220 5.2~6.4 9.5~10.8 5.6~6.0 2.0~2.8 1 - The solder paste shall be printed in a thickness of 150 to 200m. 2 - The SIR test of the solder paste shall be doneBased on JIS-Z-3284 3 - IR reflow Pb Free Process suggestin profile (Based on J-STD-020-C): Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not subjected to a thermal gradient steeper than 3 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 175 degrees of the solders peak temperature is essential to minimize thermal shock. 4 - Soldering recommend paste is Sn 96.5/Ag 3.5 Peak Temp. 260C 275 (3 to 10sec) - Preheat 250 1.The temperature rising speed is suggested to be 2~3/s. 225 2.Appropriate preheat time will be from 60 to 120 seconds. 200 3.Temp. maintain at 175 +/-25C 120 seconds. 175 - Heating Peak Temp. 1.Careful about sudden rise in temperature as it may worsen 150 245C the solder ability. 125 (10 to 20sec) Peak Temp. 2.Set the peak temperature in 23510-20s or 260C 3-10s. 175C 100 (60 to 120sec) - Cooling 75 1.Ramp down rate 6C/s max. 25 Perform adequate test in advance as the reflow temperature 02:00:00 03:00:00 04:00:00 01:00:00 Time (mn) profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace Peak Temp. 4 - Wave Soldering Process 260C 275 (3 to 10sec) Ramp-up rate 3C/s max. 250 Temp. maintain at 175 +/-25C 180 seconds max. 225 Peak temperature 260C 3-10s. 200 Ramp down rate 6C/s max. 175 to thermal shock, a preheat is recommended in the soldering 150 process. and the peak temperature should be under controlled 125 rigidly in the solder process. 100 Preheat. 5 - Hand Soldering Process 75 175C 150sec max. Preheating 150C 25 Temperature of soldering iron tip 380C max. 3 to 5 sec 01:00:00 02:00:00 03:00:00 04:00:00 The Varistorrs shall be cooled gradually at room ambient temperature Time (mn) 6 - Ultrasonic cleaning For preventing failures or damages. Frequency 29MHz max - radied Power 20W/l max - Period 5mn max Wrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex departmentWrth Elektronik eiSos GmbH & Co.KG - Radialex department D-74638 Waldenburg Max-Eyth-Strae 1 - 3 Germany Telefon (+49) (0) 7942 - 945 - 0 Telefax (+49) (0) 7942 - 945 - 400