Keyswitch ML Series ML Notebook Profile Dimensions: Inches (mm) 0.472 0.173 (12) (4.4) 0.098 + 0.106 0.008 - (2.5) + (2.7 0.2) - 0.449 (11.4) 0.154 (3.9) 0.272 (6.9) Specifications Mechanical Motion Voltage 12 VAC/DC max. 2 VDC min. Function Normally open contact Current 10mA AC/DC max. 100 A DC min. Total Travel 0.118 -0.020 Insulation Resistance 100 M at 100V Pretravel 0.059 0.020 Bounce Time 5ms (at op. speed 0.4m/s) Initial Actuating Force 1.058 oz min. Life >20 million operations Operating Force 1.587 0.705 oz Initial Contact Resist. <200 m (25 m typical) Tactile Force 1.764 0.705 oz Materials End force Max. 2.998 oz, typical 2.469 oz Plastics Thermoplastic, UL-rated Contacts AuAg 10 Spring Stainless steel Flammability Rating UL94HB Solderability Wave solder 5 seconds at 500F Environmental Operating Temp. Range -10 to +70C Storage Temp. Range -40 to +70C Relative Humidity 5% to 95%, non-condensing 10-6Keyswitch ML Series Force/Travel Diagram Circuit Board Layout Tactile Position Operating Position + + 0.20 0.002 0.20 0.002 - - 120 + 0.15 0.002 - 100 80 60 0.05 + 0.20 0.002 - 40 0.05 Reset 20 Position Drilled Punched + + 0.055 0.002 0.055 0.002 - - 12 3 Travel (mm) + + 0.055 0.002 0.055 0.002 - - Part Number: ML 1A 11 JW + + 0.059 0.001 0.057 0.002 - - + + 0.102 0.004 0.102 0.004 - - Soldering Parameters PC Board FR 2 PC Board FR 2 Material FR 4 Material Foam Flux CEM 1 v 2.3 m/min h Minimum height however the PCB must be moistened equaly with flux (the foam wave must not be interrupted) Flux Ordering Information Density 0.84 g/cm Part Number Description Pre-heating ML1A-11NW Standard force, tactile, PCB mount v 2.3 m/min t 200 to 280C (6 pre-heating plates t increases ML1A-11JW Standard force, tactile, PCB mount, regulary) on the PCB bottom side. A temperature integrated jumper wire of 80 to 85C is being reached. h Distance between heating plate and PCB bottom side is approximately 66 mm. Soldering v 2.3 m/min Sol< 6 to 7 t 255 to 260C (according to display) 10 10-7 Force (cN)