TC72-3.3MMFTR

TC72 Digital Temperature Sensor with SPI Interface Features General Description Temperature-to-Digital Converter TC72 is a digital temperature sensor capable of reading temperatures from -55C to +125C. This SPI Compatible Interface sensor features a serial interface that allows 10-Bit Resolution (0.25C/Bit) communication with a host controller or other 2C (maximum) Accuracy from -40C to +85C peripherals. The TC72 interface is compatible with the 3C (maximum) Accuracy from -55C to +125C SPI protocol, and does not require any additional 2.65V to 5.5V Operating Range external components. However, it is recommended that Low Power Consumption: a decoupling capacitor of 0.01 F to 0.1 F be provided between the V and GND pins. DD - 250 A (typical) Continuous Temperature Conversion Mode TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. - 1 A (maximum) Shutdown Mode The Continuous Conversion mode measures the Power Saving One-Shot Temperature temperature approximately every 150 ms and stores Measurement the data in the temperature registers. In contrast, the Industry Standard 8-Pin MSOP Package One-Shot mode performs a single temperature Space Saving 8-Pin DFN (3x3 mm) Package measurement and returns to the power saving shutdown mode. Typical Applications TC72 features high temperature accuracy, ease-of-use Personal Computers and Servers and is the ideal solution for implementing thermal management in a variety of systems. The device is Hard Disk Drives and Other PC Peripherals available in both 8-pin MSOP and 8-pin DFN space- Entertainment Systems saving packages. TC72 also features a Shutdown Office Equipment mode for low power operation. Datacom Equipment Mobile Phones Block Diagram General Purpose Temperature Monitoring V DD Package Types Internal TC72 Diode TC72 Temperature MSOP Sensor NC 1 8 V DD CE 2 7 NC Manufacturer SCK 3 6 SDI ID Register 10-Bit GND 4 5 SDO Sigma Delta A/D Converter TC72 CE Serial 3x3 DFN* SCK Port SDO Interface NC 1 8 V DD SDI Temperature Register SCK NC 2 7 EP 9 CE SDO 3 6 GND Control GND 4 5 SDI Register * Includes Exposed Thermal Pad (EP) see Table 3-1. 2011 Microchip Technology Inc. DS21743B-page 1TC72 NOTES: DS21743B-page 2 2011 Microchip Technology Inc.