2Gb: x16 gDDR3 SDRAM Graphics Addendum Features gDDR3 SDRAM Graphics Addendum MT41J128M16 16 Meg x 16 x 8 Banks Multipurpose register Features Output driver calibration V = V = +1.5V (1.4251.575V) DD DDQ Options Marking V = V = +1.35V (1.2831.45V) capable at down DD DDQ Configuration clocked speeds 128 Meg x 16 128M16 Differential bidirectional data strobe FBGA package (Pb-free) x16 8n-bit prefetch architecture 96-ball (9mm x 14mm) Rev. D HA Differential clock inputs (CK, CK ) 96-ball (8mm x 14mm) Rev. K JT 8 internal banks Timing cycle time Nominal and dynamic on-die termination (ODT) 1 1.0ns CL = 14 (gDDR3-2000) -093G for data, strobe, and mask signals 1.1ns CL = 13 (gDDR3-1800) -107G Programmable CAS READ latency (CL) 1.25ns CL = 11 (gDDR3-1600) -125G Posted CAS additive latency (AL): 0, CL - 1, CL - 2 Operating temperature Programmable CAS WRITE latency (CWL) Commercial (0C T 95C) None Fixed burst length (BL) of 8 and burst chop (BC) of 4 C 2 Revision :D /:K (via the mode register set MRS ) Selectable BC4 or BL8 on-the-fly (OTF) 1. Only available on Revision K. Notes: Self refresh mode 2. Revision D is not 1.35V capable. T of 0C to 95C C 3. For complete device functionality and speci- 64ms, 8192 cycle refresh at 0C to 85C fications, refer to the standard 2Gb DDR3 32ms at 85C to 115C SDRAM data sheet found at www.mi- Self refresh temperature (SRT) cron.com. The information in this data Automatic self refresh (ASR) sheet supersedes the standard data sheet. Write leveling Table 1: Key Timing Parameters t t t t Speed Grade Data Rate (MT/s) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) 1 -093G 2000 14-14-14 14 14 14 2 -107G 1800 13-13-13 14.3 14.3 14.3 2 -125G 1600 11-11-11 13.75 13.75 13.75 1. Requires V = V = +1.5V Notes: DD DDQ NOM 2. V = V = +1.35V capable DD DDQ NOM Table 2: Addressing Parameter 64 Meg x 16 Configuration 16 Meg x 16 x 8 banks Refresh count 8K Row addressing 16K (A 13:0 ) Bank addressing 8 (BA 2:0 ) Column addressing 1K (A 9:0 ) PDF: 09005aef84255871 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 ddr3 2gb graphics addendum.pdf - Rev. F 08/13 EN 2010 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.2Gb: x16 gDDR3 SDRAM Graphics Addendum Features Table 3: Part Number Cross Reference Micron Part Number FBGA Code MT41J128M16JT-093G:K D9PTD MT41J128M16JT-107G:K D9PRS MT41J128M16JT-125G:K D9PRV MT41J128M16HA-107G:D D9PFS MT41J128M16HA-125G:D D9MGG FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Microns FBGA part marking decoder is available at www.micron.com/decoder. PDF: 09005aef84255871 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 ddr3 2gb graphics addendum.pdf - Rev. F 08/13 EN 2010 Micron Technology, Inc. All rights reserved.