NXP Semiconductors K22P121M120SF7 Data Sheet: Technical Data Rev. 7.1, 08/2016 Kinetis K22F 512KB Flash MK22FN512VDC12 120 MHz ARM Cortex-M4 Based Microcontroller with FPU MK22FN512VLL12 MK22FN512VLH12 MK22FN512VMP12 The Kinetis K22 product family members are optimized for cost- sensitive applications requiring low-power, USB connectivity, and MK22FN512VFX12 processing efficiency and high peripheral integration with a floating point unit. These devices share the comprehensive enablement and scalability of the Kinetis family. This product offers: Run power consumption down to 156 A/MHz and static 100 & 64 LQFP(LL&LH) 121 XFBGA (DC) 14x14x1.4 mm P .5(LL) power consumption down to 3.8 A, full state retention and 8 x 8 x 0.5 mm P .65 10x10x1.4 mm P .5(LH) 6 S wakeup. Lowest static mode down to 140 nA. USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO voltage regulator. USB FS device crystal-less functionality. 64 MAPBGA (MP) 88 QFN (FX) 5 x 5 x 1.2 mm P .5 10 x 10 x 0.9 mm P .4 Performance Analog modules 120 MHz ARM Cortex-M4 core with DSP instructions Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode) 2 delivering 1.25 Dhrystone MIPS per MHz Two 12-bit DACs Two analog comparators (CMP) with 6-bit DAC Memories and memory interfaces Accurate internal voltage reference 512 KB of embedded flash and 128 KB of RAM 1 FlexBus external bus interface System peripherals Serial programming interface (EzPort) Flexible low-power modes, multiple wake-up Preprogrammed Kinetis flashloader for one-time, in- sources system factory programming 16-channel DMA controller Independent external and software watchdog Timers monitor Two 8-ch general purpose/PWM timers Two 2-ch general purpose timers with quadrature Clocks decoder functionality Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz Periodic interrupt timers or 3-32 MHz 16-bit low-power timer Three internal oscillators: 32 kHz, 4 MHz, & 48 MHz Real-time clock with independent power domain Multipurpose clock generator with PLL and FLL Programmable delay block Communication interfaces Security and integrity modules USB full/low-speed On-the-Go controller Hardware CRC module USB full-speed device crystal-less operation 128-bit unique identification (ID) number per chip Two SPI modules and I2S module Hardware random-number generator Three UART modules and one low-power UART Flash access control to protect proprietary software Two I2C: Support for up to 1 Mbps operation Operating Characteristics Human-machine interface Voltage range (including flash writes): 1.71 to 3.6 V Up to 81 general-purpose I/O (GPIO) Temperature range (ambient): -40 to 105C NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.1. MK22FN512VFX12 (88QFN) does not support the FlexBus function. 2. MK22FN512VFX12 (88QFN) does not support the DAC1 function. Ordering Information Part Number Memory Maximum number of I/O s Flash (KB) SRAM (KB) MK22FN512VDC12 512 128 81 MK22FN512VLL12 512 128 66 MK22FN512VLH12 512 128 40 MK22FN512VMP12 512 128 40 MK22FN512VFX12 512 128 60 Device Revision Number Device Mask Set Number SIM SDID REVID JTAG ID Register PRN 0N50M 0001 0001 Related Resources Type Description Document Selector Guide The NXP Solution Advisor is a web-based tool that features interactive KINETISKMCUSELGD application wizards and a dynamic product selector Product Brief The Product Brief contains concise overview/summary information to enable K22FPB quick evaluation of a device for design suitability. Reference The Reference Manual contains a comprehensive description of the K22P121M120SF7RM Manual structure and function (operation) of a device. Data Sheet The Data Sheet is this document. It includes electrical characteristics and K22P121M120SF7 signal connections. 1 Chip Errata The chip mask set Errata provides additional or corrective information for a KINETIS K xN50M particular device mask set. Package drawing Package dimensions are provided by part number: Package drawing: MK22FN512VDC12 98ASA00595D MK22FN512VLL12 98ASS23308W MK22FN512VLH12 98ASS23234W MK22FN512VMP12 98ASA00420D MK22FN512VFX12 98ASA00935D Engineering This engineering bulletin gives connection recommendations specifically for Electrical Connection Bulletin microcontrollers in DFN and QFN packages. Recommendations for the Exposed Pad on QFN and DFN Packages. 1. To find the associated resource, go to nxp.com and perform a search using this term with the x replaced by the revision of the device you are using. Figure 1 shows the functional modules in the chip. 2 Kinetis K22F 512KB Flash, Rev. 7.1, 08/2016 NXP Semiconductors