Arria 10 SoC SoM System-on-Module featuring Highly integrated Altera Arria10 SoC Module 270 or 660 KLE, Commercial or Industrial Temp grade Dual mode as a System-on-module or FMC carrier board 2x Gbit Ethernet HPS, USB 2.0 OTG, USB 3.0 DDR4 HPS and FPGA eMMC Flash Memory PCIe Gen3 x8 Dual FMC Capability Target markets: Automotive Military Industrial Medical Video Broadcast Test & Measurement Machine and Intelligent Vision Contact : North America Sales Office Europe Sales Office salesusa reflexces.com sales reflexces.com www.reflexces.comArria 10 SoC SoM Full Specifications TM TM Arria 10 SoC FPGA Dual ARM Cortex -A9 MPCore processor-based hard processor system (HPS) 270 KLE or 660 KLE - F34 package (1152 pins) Commercial or Industrial temp grade 2x DDR4 SDRAM 32-bit wide bank for FPGA (2GB with Lite and Indus or 4GB with Turbo version) up to 2400MT/s 32-bit wide bank for HPS (2GB with Lite and Indus or 4GB with Turbo version) System-on-Module usage 1x FMC LPC bottom connector with HPS signals and 14 transceivers (Bottom- (Bottom connectors only) Right) 1x FMC HPC or LPC bottom connector depending on FPGA density (Bottom-Left): LPC bottom connector for 270 KLE density with 10 transceivers HPC bottom connector for 660 KLE density with 10 transceivers Carrier board usage In addition to the System-on-Module usage, (Bottom and Top connectors) 1x FMC LPC Top connector with 10 transceivers, 1.8V VITA 57.1 (Top-Right) 1x FMC HPC or LPC Top connector with 10 transceivers, 1.8V VITA 57.1 (Top- Left): LPC Top connector for 270 KLE density HPC Top connector for 660 KLE density LVDS, LVCMOS & XCVR 24 transceivers speed of 11.3Gbps, most optimized use 80 LVDS bidirectional (or 160 Single ended) on FMC HPC connector (Top-Left/Bot- Left) 32 LVDS bidirectional (or 64 Single ended) on FMC LPC connector (Top-Right/Bot- Right) USB 3.0 Device USB 3.0 device connectivity using Cypress FX3 super speed controller (660 KLE USB 2.0 Device/Host version) USB OTG support connected to the HPS System Controller Max10 CPLD for system control 2x Gigabit Ethernet 10/100/1000 Base-T Ethernet interfaces connected to the HPS 2 Serial interfaces I C, UART connected to the HPS. UART connected to System controller Soft programming /eMMC Store U-boot, Kernel and RootFS (8GB on 270 KLE and 32GB on 660 KLE) FPGA programming AS configuration supported with EPCQL512, remote upgrade and failsafe Power Management PMBus support / cooling solution provided With heat spreader and active heatsink 86mm x 95mm (3,4 x 3,8 inches) Module dimensions VHDL test designs Deliverable Mechanical files : 3D DWF/STEP models and 2D drawing (upon request) Guidelines for baseboard development (upon request) Module informations (power, decoupling, signal features, S-parameters) (upon request) Ordering information Version Part number Comments 270 KLE, speed grade -2, Commercial temp grade, Two banks ModuleLit version RXCA10S027PF34-SOM00L DDR4 / by 32bit / 4GBytes / 1866MT/s, eMMC 8GBytes, Bottom (Commercial grade) connectors 660 KLE, speed grade -1, Commercial temp grade, Two banks ModuleTurb version RXCA10S066PF34-SOM00T DDR4 / by 32bit / 8GBytes / 2400MT/s, eMMC 32GBytes, (Commercial grade) USB3.0, Bottom & Top connectors 660 KLE, speed grade -1, Industrial temp grade, Two banks DDR4 ModuleIndu version RXCA10S066PF34-SOM00I / by 32bit / 4GBytes / 2400MT/s, eMMC 32Gbytes, USB3.0, (Industrial grade) Bottom & Top connectors Development Kit : For the Development Kit, ask information about the Achilles Instant-DevKit (flyer available) The Kit is using the Turbo version A C H I L L E S REFLEX CES 2017 All Rights Reserved June/v3.0 www.reflexces.com