L3G4200DTR STMicroelectronics

L3G4200D MEMS motion sensor: ultra-stable three-axis digital output gyroscope Preliminary data Features Three selectable full scales (250/500/2000 dps) 2 I C/SPI digital output interface 16 bit-rate value data output 8-bit temperature data output LGA-16 (4x4x1.1 mm) Two digital output lines (interrupt and data ready) Integrated low- and high-pass filters with user- Description selectable bandwidth The L3G4200D is a low-power three-axis angular Ultra-stable over temperature and time rate sensor able to provide unprecedented Wide supply voltage: 2.4 V to 3.6 V stablility of zero rate level and sensitivity over Low voltage-compatible IOs (1.8 V) temperature and time. It includes a sensing element and an IC interface capable of providing Embedded power-down and sleep mode the measured angular rate to the external world Embedded temperature sensor 2 through a digital interface (I C/SPI). Embedded FIFO The sensing element is manufactured using a High shock survivability dedicated micro-machining process developed by STMicroelectronics to produce inertial sensors Extended operating temperature range (-40 C and actuators on silicon wafers. to +85 C) ECOPACK RoHS and Green compliant The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to Applications better match the sensing element characteristics. Gaming and virtual reality input devices The L3G4200D has a full scale of 250/500/ Motion control with MMI (man-machine 2000 dps and is capable of measuring rates with interface) a user-selectable bandwidth. GPS navigation systems The L3G4200D is available in a plastic land grid Appliances and robotics array (LGA) package and can operate within a temperature range of -40 C to +85 C. Table 1. Device summary Order code Temperature range (C) Package Packing L3G4200D -40 to +85 LGA-16 (4x4x1.1 mm) Tray L3G4200DTR -40 to +85 LGA-16 (4x4x1.1 mm) Tape and reel December 2010 Doc ID 17116 Rev 3 1/42 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to www.st.com 42 change without notice.L3G4200D Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Mechanical and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4.2 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.6.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.6.3 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3 Main digital blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.2.3 Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.2.4 Bypass-to-stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.2.5 Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.2.6 Retrieve data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2/42 Doc ID 17116 Rev 3