L3GD20H STMicroelectronics

L3GD20H MEMS motion sensor: three-axis digital output gyroscope Datasheet - production data Applications Gaming and virtual reality input devices Motion control with MMI (man-machine interface) GPS navigation systems Appliances and robotics LGA-16 (3x3x1 mm) Description Features The L3GD20H is a low-power three-axis angular rate sensor. Wide supply voltage, 2.2 V to 3.6 V It includes a sensing element and an IC interface Wide extended operating temperature range able to provide the measured angular rate to the (from -40 C to 85 C) 2 external world through digital interface (I C/SPI). Low voltage compatible IOs, 1.8 V The sensing element is manufactured using a Low power consumption dedicated micromachining process developed by Embedded power-down ST to produce inertial sensors and actuators on Sleep mode silicon wafers. Fast turn-on and wake-up The IC interface is manufactured using a CMOS process that allows a high level of integration to Three selectable full scales up to 2000 dps design a dedicated circuit which is trimmed to 16 bit rate value data output better match the sensing element characteristics. 8 bit temperature data output The L3GD20H has a full scale of 2 I C/SPI digital output interface 245/500/2000 dps and is capable of 2 dedicated lines (1 interrupt, 1 data ready) measuring rates with a user selectable bandwidth. User enable integrated high-pass filters The L3GD20H is available in a plastic land grid Embedded temperature sensor array (LGA) package and can operate within a Embedded 32 levels of 16 bit data output FIFO temperature range from -40 C to +85 C. High shock survivability ECOPACK RoHS and Green compliant Table 1. Device summary Order code Temperature range (C) Package Packing L3GD20H -40 to +85 LGA-16 (3x3x1) Tray L3GD20HTR -40 to +85 LGA-16 (3x3x1) Tape and reel March 2013 DocID023469 Rev 2 1/52 This is information on a product in full production. www.st.com 52Contents L3GD20H Contents 1 Block diagram and pin description . 8 1.1 Pin description 8 2 Mechanical and electrical specifications . 10 2.1 Mechanical characteristics 10 2.2 Electrical characteristics .11 2.3 Temperature sensor characteristics . 12 2.4 Communication interface characteristics . 13 2.4.1 SPI - serial peripheral interface . 13 2.4.2 I2C - Inter IC control interface 14 2.5 Absolute maximum ratings 15 2.6 Terminology . 16 2.6.1 Sensitivity 16 2.6.2 Zero-rate level 16 2.7 Soldering information 16 3 Application hints . 17 4 Digital main blocks . 18 4.1 Block diagram 18 4.2 FIFO . 18 4.2.1 Bypass mode . 19 4.2.2 FIFO mode . 19 4.2.3 Stream mode - dynamic stream . 20 4.2.4 Stream-to-FIFO mode 22 4.2.5 Bypass-to-stream mode . 23 4.2.6 Bypass-to-FIFO mode 24 4.2.7 Retrieve data from FIFO 24 4.2.8 FIFO multiple read (burst) . 24 4.3 Level-sensitive/edge sensitive/impulse sensitive data enable . 25 4.3.1 Level sensitive trigger stamping 25 4.3.2 Edge sensitive trigger 25 4.3.3 Impulse sensitive trigger 26 2/52 DocID023469 Rev 2