X-On Electronics has gained recognition as a prominent supplier of W25X40CLSSIG nor flash across the USA, India, Europe, Australia, and various other global locations. W25X40CLSSIG nor flash are a product manufactured by Winbond. We provide cost-effective solutions for nor flash, ensuring timely deliveries around the world.

W25X40CLSSIG Winbond

W25X40CLSSIG electronic component of Winbond
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See Product Specifications
Part No.W25X40CLSSIG
Manufacturer: Winbond
Category:NOR Flash
Description: NOR Flash Serial-SPI 2.5V/3.3V 4M-bit 512K x 8 8ns 8-Pin SOIC
Datasheet: W25X40CLSSIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.7402 ea
Line Total: USD 0.74

Availability - 103
Ships to you between
Fri. 14 Jun to Wed. 19 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
281 - WHS 1


Ships to you between Fri. 07 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 0.4836
10 : USD 0.4305
25 : USD 0.4261
90 : USD 0.4219
270 : USD 0.4163
540 : USD 0.4122
1080 : USD 0.4081
5040 : USD 0.404

103 - WHS 2


Ships to you between
Fri. 14 Jun to Wed. 19 Jun

MOQ : 1
Multiples : 1
1 : USD 0.7402
10 : USD 0.607
30 : USD 0.5498
90 : USD 0.442
540 : USD 0.4103
990 : USD 0.3912

1142 - WHS 3


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 0.5047
10 : USD 0.4262
100 : USD 0.425
2500 : USD 0.413
10000 : USD 0.3997
25000 : USD 0.3973

     
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We are delighted to provide the W25X40CLSSIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25X40CLSSIG and other electronic components in the NOR Flash category and beyond.

W25X40CL 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: March 25, 2014 - 1 - Revision F W25X40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5 4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 6. PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7 6.4 Write Protect (/WP) ......................................................................................................... 7 6.5 HOLD (/HOLD) ................................................................................................................ 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 7. BLOCK DIAGRAM ...................................................................................................................... 8 7.1 SPI OPERATIONS.......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Reserved Bits ................................................................................................................. 12 8.1.6 Status Register Protect (SRP) ........................................................................................ 12 8.1.7 Status Register Memory Protection ................................................................................ 13 8.2 INSTRUCTIONS ........................................................................................................... 14 8.2.1 Manufacturer and Device Identification .......................................................................... 14 (1) 8.2.2 Instruction Set ............................................................................................................. 15 8.2.3 Write Enable (06h) .......................................................................................................... 16 8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 16 8.2.5 Write Disable (04h) ......................................................................................................... 17 8.2.6 Read Status Register (05h) ............................................................................................ 17 8.2.7 Write Status Register (01h) ............................................................................................ 18 8.2.8 Read Data (03h) ............................................................................................................. 19 8.2.9 Fast Read (0Bh) ............................................................................................................. 20 8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 21 8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 22 8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 24 8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 8.2.14 Page Program (02h) ..................................................................................................... 25 8.2.15 Sector Erase (20h) ....................................................................................................... 26 Publication Release Date: March 25, 2014 - 2 - Revision F

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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