A multichip package is an integrated circuit package which contains multiple semiconductor dice. It is typically used for higher performance and for enhanced thermal, mechanical, and electrical properties. The multiple dies in a multichip package are connected by Wire bonds, Tape Automated Bonding (TAB), or Flip chip technology. Multichip package can be used to build more powerful and complex integrated circuits. Multichip packages are used in RF Applications, High-performance processors, Memories and ASICs. Multichip package helps in providing better electrical and thermal performance, higher reliability and reliability in a smaller package size.