Thermal interface products are a family of materials used to improve the thermal properties of electronic components, circuit boards and other heat-generating parts. They facilitate heat transfer by enhancing conduction and providing a cushion against mechanical distortion. Thermal interface products, also known as thermal pads, generally consist of polymers, filler particles and/or phase change materials. The traditional function of a thermal interface product is to fill the microscopic imperfections between two surfaces, creating a tighter fit and improving heat conduction. However, some products may also be used to conduct heat away from the component, dissipating the generated heat more efficiently. Applications include processors, memory, power supplies, graphics cards, conduits and plastic injection-molded housings.