2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM Series Product Features: Applications: Low Cost SMD Package Fibre Channel Low ESR Server & Storage Compatible with Leadfree Processing Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 13.3 Max. 11.4 0.2 System Clock 4.73 0.1 Frequency 3.2 MHz to 100.000 MHz H Max. See Part Number Guide ESR (Equivalent Series Resistance) 3.2 MHz 3.49 MHz 300 Max. 3.5 MHz 3.99 MHz 200 Max. 4.0 MHz 4.99 MHz 150 Max. 5.0 MHz 5.99 MHz 120 Max. 6.0 MHz 6.99 MHz 100 Max. 3.9 Nom. 7.0 MHz 8.9 MHz 80 Max. 9.0 MHz 12.9 MHz 60 Max. 13 MHz 19.9 MHz 40 Max. 20 MHz 36 MHz 30 Max. 0.5 Min. rd 27 MHz 100 MHz (3 O.T.) 100 Max. Insulator Shunt Capacitance (C0) 7 pF Max. 0.8 0.2 Frequency Tolerance 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over 50 ppm Standard (see Part Number Guide for more options) Temperature Crystal Cut AT Cut Standard 5.5 Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 1 mW Max. Aging 5 ppm Max. / Year Standard 1.6 Temperature Recommended Pad Layout 0 C to +70 C Standard (see Part Number Guide for more Operating options) Dimension Units: mm Storage -40 C to +85 C Standard Part Number Guide Sample Part Number: HC49USM FB1F18 - 20.000 Package Tolerance Stability Operating Mode Load Capacitance Frequency (overtone) (ppm) at Room (ppm) over Operating Temperature Range (pF) Temperature Temperature B = 50 ppm B = 50 ppm 0 = 0C to +50C F = Fundamental HC49USM - rd F = 30 ppm F = 30 ppm 1 = 0C to +70C 3 = 3 overtone (4.5 mm H) G = 25 ppm G = 25 ppm 2 = -10C to +60C 18 pF Standard HC49USM2 - - 20.000 MHz (3.5 mm H) or Specify H = 20 ppm H = 20 ppm 3 = -20C to +70C HC49USM3 - I = 15 ppm I = 15 ppm 5 = -40C to +85C (3.1 mm H) J = 10 ppm J = 10 ppm 9 = -10C to +50C ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 04/09 Specifications subject to change without notice Page 1 2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = N/A Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Tape and Reel Information: Quantity per 1000 Reel A 24 +/-.3 B 12 +/-.2 C 11.5 +/-.2 D 25 +/-1.5 E 80/100 F 330 Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 04/09 Specifications subject to change without notice Page 2