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ADL5321ARKZ-R7

ADL5321ARKZ-R7 electronic component of Analog Devices

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RF Amplifier 1/4W 1700 - 2400MHz BTS PA Pre-Driver

Manufacturer: Analog Devices
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1: USD 6.0912 ea
Line Total: USD 6.09

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Ships to you between Thu. 09 May to Mon. 13 May

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ADL5321ARKZ-R7
Analog Devices

1000 : USD 5.3914

     
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2.3 GHz to 4.0 GHz Watt RF Driver Amplifier Data Sheet ADL5321 FEATURES FUNCTIONAL BLOCK DIAGRAM GND Operation: 2.3 GHz to 4.0 GHz (2) Gain of 14.0 dB at 2.6 GHz OIP3 of 41.0 dBm at 2.6 GHz ADL5321 P1dB of 25.7 dBm at 2.6 GHz Noise figure: 4.0 dB at 2.6 GHz BIAS Power supply voltage: 3.3 V to 5 V 1 2 3 Power supply current: 37 mA to 90 mA RFIN GND RFOUT Dynamically adjustable bias No bias resistor required Figure 1. Thermally efficient, MSL-1 rated SOT-89 package Operating temperature range: 40C to +105C ESD rating of 2 kV (Class 3A) APPLICATIONS Wireless infrastructure Automated test equipment ISM/AMR applications GENERAL DESCRIPTION The ADL5321 incorporates a dynamically adjustable biasing The ADL5321 also delivers excellent adjacent channel leakage ratio (ACLR) vs. P circuit that allows for the customization of OIP3 and P1dB OUT. For output powers up to 10 dBm rms, the performance from 3.3 V to 5 V without the need for an external ADL5321 adds very little distortion to the output spectrum. At bias resistor. This feature gives the designer the ability to tailor 2.6 GHz, the ACLR is 59 dB and a relative constellation error of driver amplifier performance to the specific needs of the design. 46.6 dB (<0.5% EVM) at an output power of 10 dBm rms. This feature also creates the opportunity for dynamic biasing of 30 the driver amplifier, where a variable supply is used to allow for ADJ CH LOW 2.6 GHZ ALT CH LOW 2.6 GHZ full 5 V biasing under large signal conditions and then can 40 ADJ CH LOW 3.5 GHZ reduce the supply voltage when signal levels are smaller and ALT CH UP 3.5 GHZ lower power consumption is desirable. This scalability reduces 50 the need to evaluate and inventory multiple driver amplifiers for different output power requirements from 22 dBm to 60 26 dBm output power levels. 70 The ADL5321 is also rated to operate across the wide temper- ature range of 40C to +105C for reliable performance in 80 designs that experience higher temperatures, such as power 90 amplifiers. The watt driver amplifier covers the 2.3 GHz to 10 5 0 5 10 15 20 4.0 GHz wide frequency range and only requires a few external P (dBm) OUT components to be tuned to a specific band within that wide Figure 2. WiMAX 64 QAM, 10 MHz Bandwidth, Single Carrier range. This high performance, broadband RF driver amplifier is well suited for a variety of wired and wireless applications including cellular infrastructure, ISM band power amplifiers, defense equipment, and instrumentation equipment. A fully populated evaluation board is available. Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20082014 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. ACLR (dB) 07307-001 07307-125ADL5321 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Applications ....................................................................................... 1 High Temperature and 3.3 V Operation ..................................... 10 Functional Block Diagram .............................................................. 1 Basic Layout Connections ............................................................. 11 General Description ......................................................................... 1 Soldering Information and Recommended PCB Land Pattern .......................................................................................... 11 Revision History ............................................................................... 2 Matching Procedure ................................................................... 12 Specif icat ions ..................................................................................... 3 WiMAX Operation .................................................................... 13 Typical Scattering Parameters ..................................................... 4 Evaluation Board ............................................................................ 14 Absolute Maximum Ratings ............................................................ 5 Outline Dimensions ....................................................................... 16 Thermal Resistance ...................................................................... 5 Ordering Guide .......................................................................... 16 ESD Caution .................................................................................. 5 Pin Configuration and Function Descriptions ............................. 6 REVISION HISTORY 3/14Rev. C to Rev. D Changes to Figure 29 ...................................................................... 11 Updated Outline Dimensions ....................................................... 16 7/12Rev. B to Rev. C Change to Title .................................................................................. 1 Changes to Table 1 ............................................................................ 3 Replaced Table 2 ............................................................................... 4 Changes to Table 3 and Table 4 ............................................................... 5 Added Figure 20 Renumbered Sequentially ........................................ 9 Moved High Temperature and 3.3 V Operation Section and added Figure 30 to Figure 32 ............................................................................. 10 Changes to Soldering Information and Recommended PCB Land Pattern Section and changes to Figure 22 ................................. 11 6/10Rev. A to Rev. B Changes to General Description Section ...................................... 1 Changes to Operating Temperature Range, Table 3 .................... 4 Added High Temperature Operation Section, Figure 27, Figure 28, and Figure 29 ................................................................................... 13 Changes to Ordering Guide .......................................................... 16 2/09Rev. 0 to Rev. A Updated Outline Dimensions ....................................................... 15 Changes to Ordering Guide .......................................................... 15 5/08Revision 0: Initial Version Rev. D Page 2 of 16

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
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