EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX14576/MAX14636/ USB Charger Detectors MAX14637 General Description Benefits and Features The MAX14576/MAX14636/MAX14637 are USB charger High Level of Integration detectors. The MAX14576/MAX14636/MAX14637 will Capability to Withstand -6V to +30V (Absolute pass USB Battery Charger Specification Revision 1.2 (USB Maximum) on VBUS Line BC 1.2) compliance tests. The MAX14636/MAX14637 can USB Battery Charger Detection also detect Apple chargers, and other nonstandard types. - Will Pass USB Battery Charger Specification Rev 1.2 Compliance Tests These devices are capable of detecting multiple USB battery charging methods, including standard downstream - USB DCP, SDP, and CDP Detection - Proprietary Charger Detection Capability ports (SDP), charging downstream ports (CDP), and dedi- cated charger ports (DCP). The devices also feature USB (MAX14636/MAX14637) USB 2.0 Hi-Speed Switch with 3 (typ) On-Resistance BC 1.2 defined dead-battery option support. and 4.5pF (typ) On-Capacitance The MAX14576/MAX14636/MAX14637 feature analog High ESD Protection on CDP and CDN switches that are capable of passing USB Hi-Speed, full- - 15kVHBM speed, and low-speed signals. The switches have low on- - 15kVIEC 61000-4-2 Air-Gap Discharge resistance (3I, typ) and low on-capacitance (4.5pF, typ). - 8kVIEC 61000-4-2 Contact Discharge The CDN and CDP are high ESD protected up to Q15kV 15kV HBM ESD Protection VBUS When Bypassed Human Body Model (HBM), Q15kV IEC61000-4-2 Air Gap with 0.1F or Greater Ceramic Capacitor Discharge, and Q 8kV IEC61000-4-2 Contact Discharge. Save Power in Portable Applications The MAX14576/MAX14636/MAX14637 are available in Low Supply Current (150A, typ) a 10-pin (1.6mm x 2.1mm) UTQFN package and operate Space Saving over the 0C to +70C extended temperature range. 10-Pin, 1.6mm x 2.1mm, UTQFN Package Applications Ordering Information/Selector guide appears at end of data Cell Phones Tablets sheet. Digital Cameras Portable Industrial eReaders Products Functional Diagram/Typical Application Circuit VBUS PMIC CHG DET V BUS INTERNAL POWER V V IO IO I/O CONTROL USB CHG AL N CHARGER DETECTION SW OPEN MICRO- VBUS PROCESSOR D- CDN TDN USB/MICRO-USB D+ CDP TDP CONNECTOR GND GOOD BAT MAX14576 1M 1M 1M MAX14636 (MAX14636/ (MAX14636/ MAX14637) MAX14637 MAX14637) GND 19-6457 Rev 5 5/19MAX14576/MAX14636/ USB Charger Detectors MAX14637 Absolute Maximum Ratings (All voltages referenced to GND.) Continuous Power Dissipation (T = +70C) A V ......................................................................-6V to +30V UTQFN (derate 9mW/C above +70C) ......................722mW VBUS CHG AL N............................................................-0.3V to +30V Operating Temperature Range ...............................0C to +70C SW OPEN, GOOD BAT .........................................-0.3V to +6V Maximum Junction Temperature .....................................+150C CHG DET (Note 1) .............................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C CCINT TDP, TDN ............................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C CCINT CDP, CDN............................................................... -0.3V to +6V Soldering Temperature (reflow) .......................................+260C Continuous Current into All Terminals ..............................50mA Note 1: V = min (V , +4.2V). CCINT VBUS Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 10 ULTRA QFN Package Code V101A2CN+1 Outline Number 21-0610 Land Pattern Number 90-0386 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 110.8C/W JA Junction to Case ( ) 62.1C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com