MAX14832 One-Time Programmable Industrial Sensor Output Driver General Description Benefits and Features The MAX14832 is a 24V, 100mA driver for industrial High Configurability binary sensors. The device is configurable through one- OTP Configurable Through Sensor Interface Pins time programming (OTP) and integrates the common Programmable High-Side (pnp), Low-Side (npn), or high-voltage circuitry needed for industrial binary sensors Push-Pull Driver into a single-device solution. Integrated transient protection LDO with Selectable 3.3V or 5V Output Voltage meets IEC60255-5 surges up to 1.3kV. Optional Pulse Stretching The output of the device can be configured for high-side Programmable POR Delay (pnp), low-side (npn), or push-pull operation through OTP. Programmable NO/NC Logic Additionally, the device features an OTP option for the Robust Design internal low-dropout (LDO) regulator, allowing the user to select a 3.3V or 5V output, as well as an option to Reverse-Polarity Protection configure the device for sensors with normally open (NO) Hot-Plug Protection or normally closed (NC) logic. Also configurable during Short-Circuit Protection on DO OTP is the timing of the power-on reset (POR) delay. Surge Protection OTP programming options are performed with the sensor 1.3kV/500W IEC 60255-5 interface pins (V , DO, and GND) using the 1-Wire CC ESD Protection interface protocol. 12kV IEC61000-4-2 Air-Gap Discharge Method The MAX14832 operates from a wide 4.75V to 34V supply 8kV IEC61000-4-2 Contact Discharge Method and is available in a 10-pin TDFN-EP (3mm x 3mm) package and 9-bump wafer-level package (WLP) (1.6mm Glitch Filtering on Logic Input x 2.0mm). The device functions over the extended -40C Accelerated Demagnetization of Inductive Load to +85C temperature range. Overtemperature Protection Saves Space on Board Applications 10-Pin TDFN-EP Package Industrial Binary Sensors Ultra-Small (1.6mm x 2.0mm) 9-Bump WLP Proximity Switches Dual, Integrated 4.5mA LED Drivers Capacitive and Inductive Sensors Typical Application Circuit LED2 LED1 0.1F 5V OR 3.3V LDO LED2 LED1 DIN1 VCC 24V SIGNAL 0.1F MAX14832 SENSING 4.7nF AND CONDITIONING DIN2 DO OUT 4.7nF GND GND GND Ordering Information appears at end of data sheet. 1-Wire is a registered trademark of Maxim Integrated Products, Inc. 19-6847 Rev 4 4/16MAX14832 One-Time Programmable Industrial Sensor Output Driver Absolute Maximum Ratings (All voltages referenced to GND.) Continuous Power Dissipation (T = +70C) A V .........................................................................-36V to +36V TDFN (derate 24.4mW/C above +70C) ...............1951.2mW CC LDO .........................................................................-0.3V to +6V WLP (derate 14.1mW/C above +70C).....................1225mW DO .......................................................the higher of (V - 36V) Operating Temperature Range ........................... -40C to +85C CC and -36V to the lesser of (V + 36V) and +36V Storage Temperature Range ............................ -65C to +150C CC DIN1, DIN2 ..............................................................-0.3V to +6V Maximum Junction Temperature .....................................+150C LED1, LED2 .......-0.3V to the higher of (V - 0.3V) and +0.3V Lead Temperature (soldering, 10s) .................................+300C CC Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TDFN WLP Junction-to-Ambient Thermal Resistance ( ) ..........41C/W Junction-to-Ambient Thermal Resistance(JA)...71C/W JA Junction-to-Case Thermal Resistance ( ) .................9C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 4.75V to +34V, V = 0V, C = 0.1F, C = 0.1F, all logic inputs at V or GND, T = -40C to +85C, unless other- CC GND VCC LDO LDO A wise noted. Typical values are at V = +24V and T = +25C.) (Note 2) CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V = 3.3V 4.75 34 LDO V Supply Voltage V V CC CC V = 5V 7 34 LDO V Supply Current, V = 24V, no external load on LDO or CC CC I 1.2 mA CC Normal Operation DO (Note 3) OTP MODE V Supply Voltage to Access CC V T = 0C to +85C 3.8 4.1 V CC,OA A OTP Mode V Supply Current to Access CC I 3.8V < V < 4.1V 1.2 mA CC,OA CC OTP Mode V Supply Voltage During CC V 12 V CC,OTP OTP (Note 4) V Supply Current During CC I 12V < V < 34V 8 mA CC,OTP CC OTP (Note 4) DO Receiver Rising Input V OTP mode 1.2 2 V DO RX R Threshold DO Receiver Falling Input V OTP mode 0.6 1.1 V DO RX F Threshold DO Pullup Voltage During V OTP mode 5.5 V DO,PU 1-Wire Communications DO V Voltage During 100 pullup between DO and V , OL CC 1.6 V 1-Wire Communications V = V DO DO,PU Maxim Integrated 2 www.maximintegrated.com