MAX1740/MAX1741 19-1458 Rev 0 1/00 SIM/Smart Card Level Translators in MAX General Description Features The MAX1740/MAX1741 subscriber identity module SIM/Smart Card Level Shifting (SIM)/smart card level translators provide level shifting 10kV ESD Card Socket Protection and electrostatic discharge (ESD) protection for SIM and smart card ports. These devices integrate two unidirec- Allows Level Translation with DV V or CC CC tional level shifters for the reset and clock signals, a bidi- DV V CC CC rectional level shifter for the serial data stream, and Automatically Shuts Down When Either Supply Is 10kV ESD protection on all card contacts. Removed The MAX1740 includes a SHDN control input to aid insertion and removal of SIM and smart cards, while the Card Contacts Actively Pulled Low During MAX1741 includes a system-side data driver to support Shutdown system controllers without open-drain outputs. The logic +1.425V to +5.5V Controller Voltage Range supply voltage range is +1.425V to +5.5V for the con- troller side and +2.25V to +5.5V for the card side. +2.25V to +5.5V Card Voltage Range Total supply current is 2.5A max. Both devices automat- 2.5A (max) Total Quiescent Supply Current ically shut down when either power supply is removed. For a complete SIM-card interface, combine the 0.01A Total Shutdown Supply Current MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regu- Ultra-Small 10-Pin MAX Package lated charge pump. Compliant with GSM Test Specifications 11.11 The MAX1740/MAX1741 are available in ultra-small 10- pin MAX packages that are only 1.09mm high and half and 11.12 the area of an 8-pin SO. The MAX1740/MAX1741 are compliant with GSM test specifications 11.11 and 11.12. Applications Ordering Information SIM Interface in GSM Cellular Telephones PART TEMP. RANGE PIN-PACKAGE Smart Card Readers MAX1740EUB -40C to +85C 10 MAX MAX1741EUB -40C to +85C 10 MAX Logic Level Translation SPI/QSPI/MICROWIRE Level Translation Typical Operating Circuit Pin Configuration DV V CC CC TOP VIEW V V DV DV CC CC CC CC DATA 1 10 IO RIN RST RST DV 2 9 V CC CC SIM OR CIN 3 8 CLK MAX1740 SYSTEM MAX1740 SMART MAX1741 CONTROLLER MAX1741 RIN 4 7 RST CARD CLK CLK CIN SHDN (DDRV) 5 6 GND DATA MAX OPTIONAL ( ) ARE FOR MAX1741. SHDN* IO IO OPTIONAL DDRV* GND GND GND SPI and QSPI are trademarks of Motorola, Inc. * SHDN FOR MAX1740 ONLY MICROWIRE is a trademark of National Semiconductor Corp. DDRV FOR MAX1741 ONLY Maxim Integrated Products 1 For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.SIM/Smart Card Level Translators in MAX ABSOLUTE MAXIMUM RATINGS DV , V to GND................................................-0.3V to +6.0V Operating Temperature Range ..........................-40C to +85C CC CC RIN, CIN, DATA, DDRV, Storage Temperature Range ............................-65C to +150C SHDN to GND ......................................-0.3V to (DV + 0.3V) Junction Temperature......................................................+150C CC RST, CLK, IO to GND ................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) ................................+300C CC Continuous Power Dissipation (T = +70C) A 10-Pin MAX (derate 5.6mW/C above +70C) ..........444mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Figure 1, DV = +1.8V, V = +3.0V or +5.0V, SHDN = DV , CIN = RIN = GND or DV , IO = V , DATA = DDRV = DV , CC CC CC CC CC CC C = C = C = C = 30pF, T = 0C to +85C, unless otherwise noted. Typical values are at T = +25C.) IO CLK RST DATA A A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES DV Operating Range DV 1.425 5.5 V CC CC V Operating Range V 2.25 5.5 V CC CC CIN static 1 CIN clocked at 1.625MHz from GND to DV CC 8 with 50% duty cycle DV Operating Current I A CC DVCC CIN clocked at 3.25MHz from GND to DV CC 16 with 50% duty cycle CIN static 1.5 A CIN clocked at 1.625MHz from GND to DV CC 0.5 with 50% duty cycle V Operating Current I CC VCC mA CIN clocked at 3.25MHz from GND to DV CC 1 with 50% duty cycle I = I + I , SHDN = GND OFF VCC DVCC Total Shutdown Current I 0.01 2 A (MAX1740 only), or DV = GND SHDN CC or V = GND CC CIN, RIN, SHDN, DDRV LOGIC INPUTS Digital Input Low Threshold V 0.2 DV V IL CC Digital Input High Threshold V 0.7 DV V IH CC Input Leakage Current 0.01 1 A CLK, RST OUTPUTS Digital Output Low Level V I = 200A 0.4 V OL SINK I = 20A 0.9 V SOURCE CC Digital Output High Level V V OH I = 200A 0.8 V SOURCE CC DATA INPUT/OUTPUT DATA Pull-Up Resistance R Between DATA and DV 13 20 28 k DATA CC Input Low Threshold V (Note 1) 0.3 V IL(DATA) Input High Threshold V (Note 2) DV - 0.6 V IH(DATA) CC Input Low Current I V = 5.0V 1 mA IL CC Input High Current I 2 A IH 2 MAX1740/MAX1741