Evaluation Kit Design Tools Support Available Resources and Models Click here to ask an associate for production status of specific part numbers. 2A Synchronous-Buck LED Drivers MAX20050MAX20053 with Integrated MOSFETs General Description Benefits and Features The MAX20050MAX20053 are high-brightness LED (HB Automotive Ready: AEC-Q100 Qualified LED) drivers for automotive exterior lighting applications. Fully Synchronous 2A Step-Down Converter with Consisting of a fully synchronous step-down converter Integrated 0.14 (typ) MOSFETs with integrated MOSFETs, the devices are capable of Wide 4.5V to 65V Input Supply Range driving a series string of LEDs at up to 2A, with a mini- mum number of external components. The MAX20050/ Two Switching Frequency Options: 400kHz and MAX20052 utilize internal loop compensation to mini- 2.1MHz mize component count, while the MAX20051/MAX20053/ Internal Loop Compensation (MAX20050/MAX20052) MAX20053D use external compensation for full flexibility. and External Loop Compensation The wide 4.5V to 65V input supply range supports (MAX20051/MAX20053/MAX20053D) Options extreme automotive cold crank and load-dump condi- Switching Frequency Synchronized to PWM Dimming tions. A low- and high-switching frequency option (400kHz Signal or 2.1MHz) provides the designer with the flexibility to optimize for solution size or efficiency, while avoiding Active-Low Fault (FLT) Indicator interference within the AM band. Spread spectrum pro- Output Short-Circuit Protection vides further options for the designer to reduce EMI at the High-Side Current Regulation Eliminates One system level. The MAX20050/MAX20051 have an internal Connection to LED String switching frequency of 400kHz, while the MAX20052/ MAX20053/MAX20053D have an internal switching fre- Spread-Spectrum Mode Alleviates EMI Problems quency of 2.1MHz. In addition, the MAX20051B has Low 200mV Full-Scale High-Side Current-Sense spread spectrum disabled. Voltage High-side current regulation means only a single REFI Pin Adjusts LED Current Down to Zero connection to the LED string is required grounding of the string can be done locally. In addition to PWM dimming, PWM Dimming Disconnects Both High- and Low- the ICs provide analog dimming using the REFI pin. Full- Side MOSFET Drivers scale current regulation accuracy is 2.5%, while the 5V, 10mA LDO Output Provides Bias to Other accuracy is 8% at 10% of full-scale over the full tempera- Circuits ture range of -40C to +125C. A 5V, 10mA LDO output is available for biasing other circuits. Ultra-Low Shutdown Current (5A typ) Fault-protection mechanisms include output overload, Output Overload, Short-Circuit, and Overtemperature short-circuit, and device overtemperature protection. The Protections devices are specified for operation over the full -40C to 12-Pin (3mm x 3mm) TDFN, 14-Pin (5mm x 4.4mm) +125C temperature range and are available in thermally TSSOP, and 24-pin (4mm x 4mm) TQFN Package enhanced 12-pin (3mm x 3mm) TDFN and 14-pin (5mm Options x 4.4mm) TSSOP and 24-pin TQFN (4mm x 4mm) pack- ages with an exposed pad. Applications Daytime Running Lamps (DRLs) Ordering Information appears at end of data sheet. Fog Lamps Clearance Lamps (CLLs) Corner Lamps (CLs) Rear Lamps Head Lamps Commercial, Industrial, and Architectural Lighting Driver Monitoring Systems (DMS) 19-6926 Rev 20 7/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved.MAX20050MAX20053 2A Synchronous-Buck LED Drivers with Integrated MOSFETs Absolute Maximum Ratings IN to AGND............................................................-0.3V to +70V Continuous Current on IN for TQFN ....................................1.8A IN to AGND (MAX20050C/51C/52C/53C/53D only) -0.3V to 40V Continuous Current on IN for TSSOP ..................................2.1A PGND to AGND ....................................................-0.3V to +0.3V Short-Circuit Duration on V ...................................Continuous CC CS+, CS-, LX to AGND ................................-0.3V to (IN + 0.3V) Continuous Power Dissipation (T = +70C) (Note 1) A BST to AGND ........................................................-0.3V to +75V 12-Pin TDFN-EP (derate 24.4 mW/C BST to AGND (MAX20050C/51C/52C/53C/53D only) ...-0.3V to above +70C) ........................................................1951.2mW 45V 14-Pin TSSOP-EP (derate 25.6 mW/C BST to LX ................................................................-0.3V to +6V above +70C) ........................................................2051.3mW PWM, FLT to AGND ................................................-0.3V to +6V Operating Temperature Range ..........................-40C to +125C V to AGND ...............................-0.3V to MIN (+6V, IN + 0.3V) Junction Temperature ......................................................+150C CC COMP, REFI to AGND.................................-0.3V to V + 0.3V Storage Temperature Range .............................-65C to +150C CC CS+ to CS- ..........................................................-0.3V to + 0.3V Lead Temperature (soldering, 10s) .................................+300C Continuous Current on LX ....................................................2.1A Soldering Temperature (reflow) .......................................+260C Continuous Current on IN for TDFN ....................................1.6A (Note 1) Package Thermal Characteristics TDFN TQFN Junction-to-Ambient Thermal Resistance ( ) ..........41C/W Junction-to-Ambient Thermal Resistance ( ) ..........36C/W JA JA Junction-to-Case Thermal Resistance ( ) ..............8.5C/W Junction-to-Case Thermal Resistance ( ) .................3C/W JC JC TSSOP Junction-to-Ambient Thermal Resistance ( ) ..........39C/W JA Junction-to-Case Thermal Resistance ( ) .................3C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 12V, V = 1.2V, V = V , T = T = -40C to +125C, unless otherwise noted. Typical values are at T = +25C.) (Note 2) IN REFI PWM CC A J A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 4.5 65 Input Supply Voltage V V IN MAX20050C/51C/52C/53C/53D only (Note 5) 4.5 36 IN Undervoltage Lockout VIN V rising inferred by VCC 4.45 V UVLO IN UVLOR IN Undervoltage Hysteresis VINHYSTL 225 mV V = 12V 5 8 PWM = 0 IN A (no switching) V = 65V 8 20 IN V = 12V IN (MAX20050/51/ 5 10 50C/51C) Supply Current IIN Q PWM = 100% V = 12V (and during regulation mA IN (MAX20052/53/ 20 switching) /52C/53C/53D) V = 65V IN 10 (MAX20050/51) V REGULATOR (V ) CC CC I = 1mA, 5.5V < V < 65V VCC IN I = 1mA, 5.5V < V < 36V VCC IN V Output Voltage V 4.875 5 5.125 V CC CC (MAX20050C/51C/52C/53C/53D only) I = 10mA, 6V < V < 25V VCC IN Analog Devices 2 www.analog.com