Click here for production status of specific part numbers. MAX22288 Home Bus System (HBS) Compatible Transceiver General Description Benefits and Features The MAX22288 Home Bus System (HBS) compatible Robust Communication with Configurability Dynamic Cable Termination Improves Signal transceiver can be used in the Home Bus System, where Quality for High-Speed Applications data and power are passed on a single pair of wires Adjustable Slew Rates for Low EMI while minimizing the need for external components. Maximum Data Rate up to 200kbps over 1000m The MAX22288 provides robust communication by UTP Cable using dynamic cable termination that improves the Programmable Receiver Thresholds signal quality with longer cables and higher data rates. Space Saving The device data outputs AIO/BIO do not load the bus 4mm x 4mm TQFN package when the MAX22288 is not powered. The MAX22288 Pin-to-pin Compatible with the MAX22088 supports passing data with speed up to 200kbps. Integrated Protection The MAX22288 features adjustable receiver thresholds IEC 61000-4-2 8kV Contact and 15kV Air-Gap and driver slew rates that allow the MAX22288 to be ESD Protection used in a wide variety of systems. Integrated protection IEC 61000-4-5 1kV Transient Surge Protection ensures robust communication in harsh industrial with Selected External Components environments. -40C to +125C Operating Temperature Range The MAX22288 is pin-to-pin compatible with the Applications MAX22088, the Home Bus System (HBS) Compatible Transceiver with Active Inductor. The MAX22288 is HVAC recommended for use in an HBS system where an Building Controllers external power supply is typically available. Industrial IoT The MAX22288 is specified for operation over the -40C to +125C temperature range and is available in a compact 24-pin 4mm x 4mm TQFN package. Ordering Information appears at end of data sheet. Simplified Home Bus System (HBS) 18V H+ H+ POWER SUPPLY 180k 1F H- H- 100nF CAPP HPA C C C C IO IO IO IO V HP RAW 100F EN HN AIO 5V VCC AIO CAPN 1F 10F 100nF GND RTRM HNA BIO BIO R TRMO 5V OUTPUT VCC RTRMO 10F 1F TERM SRA GND MAX22088 MAX22288 TERM R SRA WDEN V CC VCC SRA RSRA TVL TVL DIN TVT TVT MICRO DIN RST CONTROLLER MICRO DOUT RST CONTROLLER DOUT 19-101199 Rev 0 7/21 MAX22288 Home Bus System (HBS) Compatible Transceiver Absolute Maximum Ratings V to GND ....................................................... -0.3V to +6.0V Single-Layer Board (T = +70C, derate 20.8mW/C above CC A +70C) .................................................................. 1666.70mW AIO, BIO, TERM to GND ................................... -0.3V to +6.0V Multilayer Board (T = +70C, derate 27.8mW/C above A SRA to GND ........................................... -0.3V to (V + 0.3)V CC +70C) .................................................................. 2222.20mW , , TVL, TVT to GND ..................... -0.3V to +6.0V Temperature Ratings DIN, DOUT, RST to GND .................................. -0.3V to +6.0V Operating Temperature Range .................. -40C to +125C Continuous Current Into Any Pin Junction Temperature .............................................. +150C V , AIO, BIO, TERM ............................................ 100mA CC Storage Temperature Range ..................... -40C to +150C All Other Pins ........................................................... 50mA Lead Temperature (soldering, 10s) .......................... +300C Continuous Power Dissipation Soldering Temperature (reflow) ................................ +260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 24-Pin TQFN Package Code T2444+4C Outline Number 21-0139 Land Pattern Number 90-0022 Thermal Resistance, Single-Layer Board: Junction-to-Ambient (JA) 48C/W Junction-to-Case Thermal Resistance (JC) 3C/W Thermal Resistance, Four-Layer Board: Junction-to-Ambient (JA) 36C/W Junction-to-Case Thermal Resistance (JC) 3C/W Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. www.maximintegrated.com Maxim Integrated 2