EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX25611A/MAX25611B/ Automotive High-Voltage HB LED Controller MAX25611C/MAX25611D General Description Benefits and Features The MAX25611A/MAX25611B/MAX25611C/MAX25611D Automotive Ready: AEC-Q100 Qualified are single-channel HBLED drivers for automo- Integration Minimizes BOM for High-Brightness tive front light applications such as high beam, LED Driver low beam, daytime running light (DRL), turn Integrated pMOS Dimming FET Gate Driver Allows indicator, fog light, and other LED lights. It can take an Single-Wire Connection to LED String input voltage from 5V to 36V and can drive a string of PWM, Analog-to-PWM and Analog Dimming LEDs with a maximum output voltage of 65V. Integrated High-Side, Current-Sense Amplifier The MAX25611A/B/C/D sense output current at 12-Pin SWTQFN-EP Package the high side of the LED string. High-side current Flexible Application Configurations sensing is required to protect for shorts from the output +5V to +36V Wide Input Voltage Range with a to the ground or battery input. It is also the most flex- Maximum +65V Boost Output ible scheme for driving LEDs, allowing boost, high-side Boost, Buck-Boost, High-Side Buck, SEPIC, Zeta, buck, SEPIC mode, or buck-boost mode configura- and Cuk Single-Channel LED Drivers tions. The PWM input provides LED dimming ratios of Protection Features and Wide Temperature Range up to 5000:1, and the REFI input provides additional Increase System Reliability analog dimming capability in the MAX25611A/B/C/D. Short-Circuit, Overvoltage, and Thermal Protection The MAX25611A/B/C/D have built-in spread-spectrum -40C to +125C Operating Temperature Range modulation for improved electromagnetic compat- ibility performance. The MAX25611A/B/C/D can also Ordering Information appears at end of data sheet. be used in zeta and Cuk converter configurations if it is necessary in some applications. Simplified Application Circuit The MAX25611A/B/C/D are available in a space-saving 12-pin SWTQFN-EP package. They are specified to oper- ate over the -40C to +125C automotive temperature range. The switching frequency is internally set at 350kHz for the MAX25611A/MAX25611C and 2.2MHz for the MAX25611B/MAX25611D. Applications Automotive Exterior Lighting High Beam/Low Beam/Signal/Position Lights Daytime Running Lights (DRLs) Fog Lights and Adaptive Front-Light Assemblies Head-Up Displays Commercial, Industrial, and Architectural Lighting 19-100429 Rev 3 8/19MAX25611A/MAX25611B/ Automotive High-Voltage HB LED Controller MAX25611C/MAX25611D Absolute Maximum Ratings IN to GND (MAX25611A/B) ...................................-0.3V to +40V Continuous Current on NDRV ..........................................+50mA IN to GND (MAX25611C/D)...................................-0.3V to +52V Short-Circuit Duration on V ...................................Continuous CC ISENSEP, ISENSEN, DIMOUT to GND ................-0.3V to +70V Continuous Power Dissipation (T = +70C) A DIMOUT to ISENSEP ..............................................-6V to +0.3V Multilayer Board ISENSEP to ISENSEN .........................................-0.3V to +0.6V TQFN (derate 25mW/C above +70C)..................... 1951mW V to GND ............................................................-0.3V to +6V TSSOP (derate 10mW/C above +70C) ...............796.80mW CC NDRV to GND .............................................-0.3V to V + 0.3V Operating Temperature Range ......................... -40C to +125C CC PWMDIM, REFI, OVP to GND ................................-0.3V to +6V Junction Temperature ......................................................+150C COMP, CS to GND ......................................-0.3V to V + 0.3V Soldering Temperature (reflow) .......................................+260C CC Continuous Current on IN ................................................100mA Lead Temperature (soldering, 10s) .................................+300C Peak Current on NDRV .........................................................1A Storage Temperature Range ............................ -65C to +150C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 12-Pin, SWTQFN-EP Package Code T1244Y+4C Outline Number 21-100312 Land Pattern Number 90-0068 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 59.3C/W JA Junction to Case ( ) 6C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 24.4C/W JA Junction to Case ( ) 41C/W JC 14-Pin, TSSOP Package Code U14+5C Outline Number 21-0066 Land Pattern Number Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 110C/W JA Junction to Case ( ) 30C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 100.4C/W JA Junction to Case ( ) 30C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com