EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX3222E/MAX3232E/ 15kV ESD-Protected, Down to 10nA, MAX3237E/MAX3241E/ 3.0V to 5.5V, Up to 1Mbps, MAX3246E True RS-232 Transceivers General Description Next-Generation Device Features The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ For Space-Constrained Applications MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24 MAX3228E/MAX3229E: 15kV ESD-Protected, communications interface devices feature low power +2.5V to +5.5V, RS-232 Transceivers in UCSP consumption, high data-rate capabilities, and enhanced For Low-Voltage or Data Cable Applications electrostatic-discharge (ESD) protection. The enhanced MAX3380E/MAX3381E: +2.35V to +5.5V, 1A, ESD structure protects all transmitter outputs and receiver 2Tx/2Rx, RS-232 Transceivers with 15kV inputs to 15kV using IEC 1000-4-2 Air-Gap Discharge, ESD-Protected I/O and Logic Pins 8kV using IEC 1000-4-2 Contact Discharge (9kV for Applications MAX3246E), and 15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are pro- Battery-Powered Equipment tected to the above standards, while the transmitter output Cell Phones Smart Phones pins are protected to 15kV using the Human Body Model. Cell-Phone Data Cables Notebook, Subnotebook, and Palmtop Computers A proprietary low-dropout transmitter output stage deliv- Printers ers true RS-232 performance from a +3.0V to +5.5V xDSL Modems power supply, using an internal dual charge pump. The charge pump requires only four small 0.1F capacitors Ordering Information for operation from a +3.3V supply. Each device guaran- tees operation at data rates of 250kbps while maintaining PART TEMP RANGE PIN-PACKAGE RS-232 output levels. The MAX3237E guarantees opera- 20 TQFN-EP** MAX3222ECTP+ 0C to +70C tion at 250kbps in the normal operating mode and 1Mbps (5mm x 5mm) in the MegaBaud operating mode, while maintaining MAX3222ECUP+ 0C to +70C 20 TSSOP RS-232-compliant output levels. MAX3222ECAP+ 0C to +70C 20 SSOP The MAX3222E/MAX3232E have two receivers and two MAX3222ECWN+ 0C to +70C 18 Wide SO transmitters. The MAX3222E features a 1A shutdown MAX3222ECPN+ 0C to +70C 18 Plastic DIP mode that reduces power consumption in battery-pow- MAX3222EC/D+ 0C to +70C Dice* ered portable systems. The MAX3222E receivers remain 20 TQFN-EP** MAX3222EETP+ -40C to +85C active in shutdown mode, allowing monitoring of external (5mm x 5mm) devices while consuming only 1A of supply current. The MAX3222EEUP/V+ -40C to +85C 20 TSSOP MAX3222E and MAX3232E are pin, package, and func- MAX3222EEUP+ -40C to +85C 20 TSSOP tionally compatible with the industry-standard MAX242 MAX3222EEAP+ -40C to +85C 20 SSOP and MAX232, respectively. MAX3222EEWN+ -40C to +85C 18 Wide SO The MAX3241E/MAX3246E are complete serial ports MAX3222EEPN+ -40C to +85C 18 Plastic DIP (three drivers/five receivers) designed for notebook and MAX3232ECAE+ 0C to +70C 16 SSOP subnotebook computers. The MAX3237E (five drivers/ three receivers) is ideal for peripheral applications that MAX3232ECWE+ 0C to +70C 16 Wide SO require fast data transfer. These devices feature a shut- MAX3232ECPE+ 0C to +70C 16 Plastic DIP down mode in which all receivers remain active, while +Denotes a lead(Pb)-free/RoHS-compliant package. consuming only 1A (MAX3241E/MAX3246E) or 10nA *Dice are tested at T = +25C, DC parameters only. A (MAX3237E). **EP = Exposed pad. The MAX3222E, MAX3232E, and MAX3241E are avail- /V denotes an automotive qualified part. able in space-saving SO, SSOP, TQFN and TSSOP pack- ages. The MAX3237E is offered in an SSOP package. Ordering Information continued at end of data sheet. The MAX3246E is offered in the ultra-small 6 x 6 UCSP package. Pin Configurations, Selector Guide, and Typical Operating MegaBaud and UCSP are trademarks of Maxim Integrated Circuits appear at end of data sheet. Products, Inc. 19-1298 Rev 13 12/18MAX3222E/MAX3232E/ 15kV ESD-Protected, Down to 10nA, MAX3237E/MAX3241E/ 3.0V to 5.5V, Up to 1Mbps, MAX3246E True RS-232 Transceivers Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V 18-Pin PDIP (derate 11.11mW/C above +70C) ........889mW CC V+ to GND (Note 1) .................................................-0.3V to +7V 20-Pin TQFN (derate 21.3mW/C above +70C) ......1702mW V- to GND (Note 1) ..................................................+0.3V to -7V 20-Pin TSSOP (derate 10.9mW/C above +70C) ......879mW V+ + V- (Note 1) ................................................................+13V 20-Pin SSOP (derate 8.00mW/C above +70C) ........640mW Input Voltages 28-Pin SSOP (derate 9.52mW/C above +70C) ........762mW T IN, EN, SHDN, MBAUD to GND .....................-0.3V to +6V 28-Pin Wide SO (derate 12.50mW/C above +70C) ........1W R IN to GND ...................................................................25V 28-Pin TSSOP (derate 12.8mW/C above +70C) ....1026mW Output Voltages 32-Pin TQFN (derate 33.3mW/C above +70C) ......2666mW T OUT to GND .............................................................13.2V 6 x 6 UCSP (derate 12.6mW/C above +70C) ........1010mW R OUT, R OUTB Operating Temperature Ranges (MAX3237E/MAX3241E) ...................... -0.3V to (V + 0.3V) MAX32 EC .................................................0C to +70C CC Short-Circuit Duration, T OUT to GND .....................Continuous MAX32 EE ............................................. -40C to +85C Continuous Power Dissipation (T = +70C) Storage Temperature Range ............................ -65C to +150C A 16-Pin SSOP (derate 7.14mW/C above +70C) ........571mW Lead Temperature (soldering, 10s) .................................+300C 16-Pin TSSOP (derate 9.4mW/C above +70C) .....754.7mW Soldering Temperature (reflow) .......................................+260C 16-Pin TQFN (derate 20.8mW/C above +70C) ...1666.7mW Bump Reflow Temperature (Note 2) 16-Pin Wide SO (derate 9.52mW/C above +70C) ...762mW Infrared, 15s ................................................................+200C 18-Pin Wide SO (derate 9.52mW/C above +70C) ...762mW Vapor Phase, 20s ........................................................+215C Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = +3V to +5.5V, C1C4 = 0.1F, T = T to T , unless otherwise noted. Typical values are at T = +25C.) (Notes 3, 4) CC A MIN MAX A PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS (V = +3.3V or +5V, T = +25C) CC A MAX3222E, MAX3232E, 0.3 1 MAX3241E, MAX3246E Supply Current SHDN = V , no load mA CC MAX3237E 0.5 2.0 SHDN = GND 1 10 A Shutdown Supply Current SHDN = R IN = GND, T IN = GND or V (MAX3237E) 10 300 nA CC LOGIC INPUTS Input Logic Low T IN, EN, SHDN, MBAUD 0.8 V V = +3.3V 2.0 CC Input Logic High T IN, EN, SHDN, MBAUD V V = +5.0V 2.4 CC Transmitter Input Hysteresis 0.5 V MAX3222E, MAX3232E, T IN, EN, SHDN 0.01 1 MAX3241E, MAX3246E Input Leakage Current A T IN, SHDN, MBAUD MAX3237E (Note 5) 9 18 Maxim Integrated 2 www.maximintegrated.com