MAX41464GUB+

EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX41463/MAX41464 300MHz960MHz (G)FSK 2 Transmitter with I C Interface General Description Benefits and Features The MAX41463/MAX41464 is a UHF sub-GHz ISM/SRD Low Implementation Cost transmitter designed to transmit Frequency-Shift Keying Bits-to-RF Single Wire Operation (FSK), or Gaussian (G)FSK (or 2GFSK) data in the 286MHz Low Bill-of-Materials (BOM) Uses Single, Low-Cost, 16MHz Crystal to 960MHz frequency range. It integrates a fractional phase- locked-loop (PLL) so that a single, low-cost crystal can be Small 3mm x 3mm MAX-10 Package Increased Range, Data Rates, and Security used to generate commonly used world-wide sub-GHz frequencies. The fast response time of the PLL allows for Up to +16dBm PA Output Power Fast Frequency Switching for FHSS/DSSS frequency-hopping spread spectrum protocols for increased range and security. The chip also features preset modes Fast-On Oscillator: <250s Startup Time Up to 200kbps NRZ Data Rate with pin-selectable frequencies so that only one wire is Extend Battery Life with Low Supply Current required for an external microcontroller interface. The only < 12mA Typical Current Consumption at 315MHz frequency-dependent components required are for the Selectable Standby and Shutdown Modes external antenna-matching network. A buffered clock-out Auto Shutdown at < 20nA (typ) Current signal at 800kHz is also provided. Optionally, the device Ease-of-Use can be put into programmable mode and programmed 2 Pin-Selectable Frequencies using an I C interface. The crystal-based architecture Pin-Compatible ASK and FSK Versions of the MAX41463/MAX41464 eliminates many of the +1.8V to +3.6V Single-Supply Operation common problems with SAW-based transmitters by 2 Fully Programmable with 400kHz/1MHz I C providing greater modulation depth, faster frequency Interface settling, higher tolerance of the transmit frequency, and reduced temperature dependence. Ordering Information appears at end of data sheet. The MAX41463/MAX41464 provides output power up to +13dBm into a 50 load while drawing < 12mA at 315MHz. The output load can be adjusted to increase power up to +16dBm, and a PA boost mode can be enabled at frequencies above 850MHz to compensate for losses. The PA output power can also be controlled using 2 programmable register settings in I C mode. Simplified Block Diagram The MAX41463/MAX41464 also features single-supply operation from +1.8V to +3.6V. The device has an auto- shutdown feature to extend battery life and a fast oscillator DATA /SDA PA CONTROL VDD wake-up with data activity detection. GND The MAX41463/MAX41464 is available in a 10-pin DATA ACTIVITY MAX package and is specified over the -40C to +105C DETECTOR extended temperature range. PA PAOUT Applications PAGND LOCK DETECT FRAC-N Building Automation and Security PLL Wireless Sensors and Alarms SEL 1:0 Remote and Passive Keyless Entry (RKE/PKE) XTAL1 CLKOUT CRYSTAL OSCILLATOR /16 /SCL Tire Pressure Monitoring Systems (TPMS) XTAL2 Automatic Meter Reading (AMR) Garage Door Openers (GDO) Radio Control Toys Internet of Things (IoT) 19-100324 Rev 4 3/19MAX41463/MAX41464 300MHz960MHz (G)FSK 2 Transmitter with I C Interface Absolute Maximum Ratings V to GND ............................................................-0.3V to +4V Junction Temperature ......................................................+150C DD All Others Pins to GND ............................ -0.3V to (V + 0.3)V Storage Temperature Range ............................ -60C to +150C DD Continuous Power Dissipation Lead Temperature (reflow) ..............................................+300C (T = +70C, derate 5.6mW/C above +70C.) ........444.4mW Soldering Temperature (reflow) .......................................+260C A Operating Temperature Range ......................... -40C to +105C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 10 MAX Package Code U10+2 Outline Number 21-0061 Land Pattern Number 90-0330 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 180C/W JA Junction to Case ( ) 36C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 113.1C/W JA Junction to Case ( ) 36C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com