X-On Electronics has gained recognition as a prominent supplier of AS3008316-035nX0PBCR MRAM across the USA, India, Europe, Australia, and various other global locations. AS3008316-035nX0PBCR MRAM are a product manufactured by Avalanche Technology. We provide cost-effective solutions for MRAM, ensuring timely deliveries around the world.

AS3008316-035nX0PBCR Avalanche Technology

AS3008316-035nX0PBCR electronic component of Avalanche Technology
AS3008316-035nX0PBCR Avalanche Technology
AS3008316-035nX0PBCR MRAM
AS3008316-035nX0PBCR  Semiconductors

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See Product Specifications
Part No. AS3008316-035nX0PBCR
Manufacturer: Avalanche Technology
Category: MRAM
Description: MRAM
Datasheet: AS3008316-035nX0PBCR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2000: USD 27.852 ea
Line Total: USD 55704 
Availability - 0
MOQ: 2000  Multiples: 2000
Pack Size: 2000
Availability Price Quantity
0
Ship by Wed. 11 Jun to Fri. 13 Jun
MOQ : 2000
Multiples : 2000
2000 : USD 27.852

   
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We are delighted to provide the AS3008316-035nX0PBCR from our MRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS3008316-035nX0PBCR and other electronic components in the MRAM category and beyond.

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1Mbit 32Mbit x16: MRAM Memory Parallel Persistent SRAM Memory (AS3001316, AS3004316, AS3008316, AS3016316, AS3032316) Features Packages Interface Parallel Asynchronous x16 44-pin TSOP (10mm x 18mm) Technology 54-pin TSOP (10mm x 22mm) 40nm pMTJ STT-MRAM 48-ball FBGA (10mm x 10mm) Virtually unlimited Endurance and Data Memory Array Organization Retention (see Endurance and Data 1Mbit Retention on page 24) 65,536 x 16 Density 4Mbit 1Mb, 4Mb, 8Mb, 16Mb, 32Mb 262,144 x 16 Operating Voltage Range 8Mbit VCC: 2.70V 3.60V 524,288 x 16 Operating Temperature Range 16Mbit Industrial: -40C to 85C 1,048,576 x 16 Industrial Plus: -40C to 105C 32Mbit RoHS Compliant 2,097,152 x 16 Performance Device Operation Typical Values Units Read Cycle Time 35.0 (minimum) ns Write Cycle Time 35.0 (minimum) ns Standby Current 1.7 (typical)* mA Sleep Mode Current 5.0 (typical)* uA Read Current 20.0 (typical) mA Write Current 20.0 (typical) mA *Number shown is for 16Mb device R e v i s i o n : P A v a l a n c h e T e c h n o l o g y P a g e 1 26 Preliminary 1Mbit 32Mbit x16: MRAM Memory Table of Contents Features ....................................................................................................................................................... 1 Performance ............................................................................................................................................... 1 Table of Contents...................................................................................................................................... 2 General Description ................................................................................................................................. 3 Ordering Options ...................................................................................................................................... 4 Valid Combinations Standard ...................................................................................................... 5 Signal Description and Assignment .................................................................................................... 8 Package Options ....................................................................................................................................... 9 44-Pin TSOP (Top View) ...................................................................................................................... 9 54-Pin TSOP (Top View) ...................................................................................................................... 9 48-Ball FBGA (Balls Down, Top View) ........................................................................................... 10 Package Drawings .................................................................................................................................. 11 44-Pin TSOP ......................................................................................................................................... 11 54-Pin TSOP ......................................................................................................................................... 12 48-Ball FBGA ........................................................................................................................................ 13 Architecture .............................................................................................................................................. 14 Device Initialization ................................................................................................................................ 15 Electrical Specifications ....................................................................................................................... 18 Write Operation ....................................................................................................................................... 20 Bus Turnaround Operation Read to Write .................................................................................... 22 Read Operation........................................................................................................................................ 23 Endurance and Data Retention ........................................................................................................... 24 Thermal Resistance................................................................................................................................ 25 Product Use Limitations ....................................................................................................................... 26 Limited Warranty ................................................................................................................................. 26 R e v i s i o n : P A v a l a n c h e T e c h n o l o g y P a g e 2 26 Preliminary

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
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