SinglFuse SF-0603SP Series Features n Time lag thin film chip fuse for overcurrent protection n 1608 (EIA 0603) miniature footprint n Surface mount packaging for automated assembly n UL listed (UL 248-14) n RoHS compliant* and halogen free** SF-0603SP Series - Time Lag Surface Mount Fuses Electrical Characteristics Rated Current Resistance Typical Model Fusing Time Rated Voltage Breaking Capacity 2 2 (Amps) (m) Typ.*** I t (A s) **** DC 50 V SF-0603SP050 0.50 264 DC 50 V 0.009 50 A SF-0603SP063 0.63 200 0.014 SF-0603SP080 0.80 143 0.023 SF-0603SP100 1.00 83 0.036 SF-0603SP125 1.25 54 0.056 Open within SF-0603SP150 1.50 42 0.081 1~120 sec. SF-0603SP160 1.60 40 0.092 DC 32 V at 200 % SF-0603SP200 2.00 28 0.145 DC 32 V 50 A rated current SF-0603SP250 2.50 21.5 0.229 SF-0603SP300 3.00 18 0.332 SF-0603SP315 3.15 16 0.365 SF-0603SP400 4.00 13 0.574 SF-0603SP500 5.00 9.5 0.927 SF-0603SP600 6.00 6 1.860 *** Resistance value measured with less than 10 % of rated current. Tolerance 25 %. 2 ****Typical I t value measured at 10x rated current. Reliability Testing Parameter Requirement Test Method Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours Fusing Time .............................................. Within 120 seconds ....................................200 % of its rated current Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm, Bending: 3 mm, 1 time, 30 seconds Resistance to Solder Heat ........................ 20 % .........................................................260 C 5 C,10 seconds 1 second Solderability .............................................. 95 % coverage minimum ...........................235 C 5 C, 2 0.5 second 245 C 5 C, 2 0.5 second (lead free) Temperature Rise ..................................... <75 C .......................................................100 % of its rated current, measure of surface temperature Resistance to Dry Heat............................. 20 % .........................................................105 C 5 C,1000 hours Resistance to Solvent ............................... No evident damage on protective ..............23 C 5 C of isopropyl alcohol, 90 seconds coating and marking Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing Thermal Shock ......................................... DR < 10 % ..................................................-20 C / +25 C /+125 C /+25 C, 10 cycles UL File Number .........................................E198545 SinglFuse SF-0603SP Series Applications n Portable memory n Cell phones n LCD monitors n Rechargeable battery packs n Disk drives n Battery chargers n PDAs n Set top boxes n Digital cameras n Industrial controllers 250 Peak: 250 +0/-5 C n DVDs 230 C or higher 200 PRE-HEATING ZONE SF-0603SP Series - Time Lag Surface Mount Fuses 180 C 150 150 C Solder Reflow Recommendations 90 30 Seconds 100 30 10 Seconds 250 Peak: 250 +0/-5 C SOLDERING ZONE 230 C or higher 50 HEATING TIME 200 PRE-HEATING ZONE 180 C PEAK: 250 +0/-5 C, 5 seconds 150 150 C PRE-HEATING ZONE: 150 to 180 C, 90 30 seconds 90 30 Seconds SOLDERING ZONE: 230 C or higher, 30 10 seconds 100 1.6 0.1 30 10 Seconds 0.7 to 0.9 (.063 .004) (.028 to .035) SOLDERING ZONE 50 HEATING TIME 0.8 to 1.0 0.8 0.1 (.031 to .039) (.031 .004) PEAK: 250 +0/-5 C, 5 seconds PRE-HEATING ZONE: 150 to 180 C, 90 30 seconds SOLDERING ZONE: 230 C or higher, 30 10 seconds Product Dimensions Recommended Pad Layout 2.0 to 2.2 0.3 0.2 0.3 0.2 (.079 to .087) (.012 .008) (.012 .008) 1.6 0.1 0.7 to 0.9 1.6 0.1 0.7 to 0.9 (.063 .004) (.028 to .035) (.063 .004) (.028 to .035) 0.45 0.1 (.018 .004) 0.8 to 1.0 0.8 0.1 0.8 to 1.0 0.8 0.1 (.031 to .039) (.031 .004) (.031 to .039) (.031 .004) 0.35 0.2 0.35 0.2 (.014 .008) (.014 .008) 2.0 to 2.2 0.3 0.2 0.3 0.2 2.0 to 2.2 0.3 0.2 0.3 0.2 (.079 to .087) (.012 .008) (.012 .008) (.079 to .087) (.012 .008) (.012 .008) MM DIMENSIONS: 0.45 0.1 (INCHES) 0.45 0.1 PACKAGING: 5,000 pcs./reel (.018 .004) (.018 .004) Thermal Derating Curve Construction & Material Content 0.35 0.2 0.35 0.2 0.35 0.2 0.35 0.2 (.014 .008) (.014 .008) (.014 .008) (.014 .008) 120 OVERCOAT 110 Sn PLATING 100 FUSE ELEMENT Cu / Ni PLATING 90 CERAMIC SUBSTRATE 80 -20 02040 60 80 100 120 AMBIENT TEMPERATURE (C) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers set forth on the last page of this document,www.bourns.com/docs/legal/disclaimer.pdf and at . TEMPERATURE (C) PERCENT OF RATING (%) TEMPERATURE (C)