HFBR-5984LZ Broadcom

HFBR-5984LZ RoHS Compliant, 200 MBd Low-Cost SBCON Transceivers in 2 x 5 SFF Package Style Data Sheet Description Features Fully RoHS Compliant The HFBR-5984LZ transceiver from Avago Multisourced 2 x 5 SFF package style with LC Technologies provides the system designer with receptacle a product to implement the SBCON specification and to be compatible with IBM ESCON Single +3.3 V power supply architecture. Wave solder and aqueous wash process compatibility This transceiver is supplied in the industry Manufactured in an ISO 9001 certified facility standard 2 x 5 SFF with an LC fiber connector SBCON 200 MBd specification interface. Transmitter Sections Applications compatible processors, The transmitter section of the HFBR-5984LZ Interconnection with IBM directors and channel attachment units utilizes a 1300 nm InGaAsP LED. This LED is Disk and tape drives packaged in the optical subassembly portion of Communication controllers the transmitter section. It is driven by a custom silicon IC which converts differential PECL Data communication equipment logic signals, ECL referenced (shifted) to a +3.3 Local area networks V supply, into an analog LED drive current. Point-to-point communication Receiver Sections The receiver section of the HFBR-5984LZ utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. It is packaged in the optical subassembly portion of the receiver. This PIN/preamplifier combination is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The Data output is differential. The Signal Detect output is single- ended. Both Data and Signal Detect outputs are PECL compatible, ECL referenced (shifted) to a +3.3 V power supply. The receiver outputs, Data Out and Data Out Bar, are squelched at Signal Detect Deassert.Package The overall package concept for the Avago The electrical subassembly consists of a high Technologies transceiver consists of three basic volume multilayer printed circuit board on elements the two optical subassemblies, an which the ICs and various surface-mounted electrical subassembly, and the housing as passive circuit elements are attached. illustrated in the block diagram in Figure 1. Both the receiver and transmitter sections The package outline drawing and pin out are include an internal shield for the electrical and shown in Figures 2 and 5. The details of this optical subassemblies to ensure high immunity package outline and pin out are compliant with to external EMI fields. the multisource definition of the 2 x 5 SFF. The The solder posts of the Avago Technologies low profile of the Avago Technologies transceiver design are isolated from the internal circuit of design complies with the maximum height the transceiver. allowed for the LC connector over the entire length of the package. The transceiver is attached to a printed circuit board with the ten signal pins and the two The optical subassemblies utilize a high-volume solder posts which exit the bottom of the assembly process together with low-cost lens housing. The two solder posts provide the elements which result in a cost-effective building primary mechanical strength to withstand the block. loads imposed on the transceiver by mating with the LC connectored fiber cables. R SUPPLY X DATA OUT QUANTIZER IC PIN PHOTODIODE DATA OUT PRE-AMPLIFIER SUBASSEMBLY R GROUND SIGNAL X LC DETECT RECEPTACLE T GROUND X LED DATA IN OPTICAL LED DRIVER IC SUBASSEMBLY DATA IN T SUPPLY X Figure 1. Block Diagram. 2