HSMS-2813-BLKG Broadcom

GUx HSMS-281x SurfaceMountRFSchottkyBarrierD iodes Data Sheet Description/Applications Features These Schottky diodes are specifically designed for both Surface Mount Packages analog and digital applications. This series offers a wide Low Flicker Noise range of specifica tions and package configur ations to Low FIT (Failure in Time) Rate* give the designer wide flexibility. The HSMS281x series of diodes features very low flicker (1/f) noise. Sixsigma Quality Level Single, Dual and Quad Versions Note that Avagos manufacturing techniques assure that dice found in pairs and quads are taken from adjacent Tape and Reel Options Available sites on the wafer, assuring the highest degree of match. Leadfree For more information see the Surface Mount Schottky Reliability Data Sheet. Pin Connections and Package Marking Package Lead Code Identification, SOT-23/SOT-143 (Top View) COMMON COMMON 1 6 SINGLE SERIES ANODE CATHODE 3 3 3 3 2 5 1 2 1 2 1 2 1 2 3 4 0 2 3 4 UNCONNECTED RING BRIDGE Notes: PAIR QUAD QUAD 3 4 3 4 3 4 1. Package marking provides orientation and identification. 2. See Electrical Specifications for appropriate package marking. 1 2 1 2 1 2 5 7 8 Package Lead Code Identification, SOT-323 Package Lead Code Identification, SOT-363 (Top View) (Top View) SERIES HIGH ISOLATION SINGLE UNCONNECTED UNCONNECTED PAIR TRIO 6 5 4 6 5 4 B C 1 2 3 1 2 3 COMMON COMMON K L ANODE CATHODE COMMON COMMON CATHODE QUAD ANODE QUAD 6 5 4 6 5 4 E F 1 2 3 1 2 3 M N BRIDGE RING QUAD QUAD 6 5 4 6 5 4 1 2 3 1 2 3 P R 1 Absolute Maximum Ratings T = 25C C Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363 I Forward Current (1 s Pulse) Amp 1 1 f P Peak Inverse Voltage V Same as V Same as V IV BR BR T Junction Temperature C 150 150 j T Storage Temperature C 65 to 150 65 to 150 stg 2 Thermal Resistance C/W 500 150 jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T = +25C, where T is defined to be the temperature at the package pins where contact is made to the circuit board. C C ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. 3 Electrical Specifications T = 25C, Single Diode C Maximum Maximum Minimum Maximum Forward Reverse Typical Part Package Breakdown Forward Voltage Leakage Maximum Dynamic Number Marking Lead Voltage Voltage V (V) I (nA) Capacitance Resistance F R 4 5 HSMS Code Code Configuration V (V) V (mV) I (mA) V (V) C (pF) R () BR F F R T D 2810 B0 0 Single 20 410 1.0 35 200 15 1.2 15 2812 B2 2 Series 2813 B3 3 Common Anode 2814 B4 4 Common Cathode 2815 B5 5 Unconnected Pair 4 2817 B7 7 Ring Quad 4 2818 B8 8 Bridge Quad 281B B0 B Single 281C B2 C Series 281E B3 E Common Anode 281F B4 F Common Cathode 281K BK K High Isolation Unconnected Pair 281L BL L Unconnected Trio Test Conditions I = 10 mA I = 1 mA V = 0 V I = 5 mA R F F F f = 1 MHz Notes: 1. V for diodes in pairs and quads in 15 mV maximum at 1 mA. F 2. C for diodes in pairs and quads is 0.2 pF maximum. TO 3. Effective Carrier Lifetime ( ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 4. See section titled Quad Capacitance. 5. R = R + 5.2 at 25C and I = 5 mA. D S f 2