HSB06-181810 CUI Devices

Hot HSB06-181810 electronic component of CUI Devices
HSB06-181810 CUI Devices
HSB06-181810 Heat Sinks
HSB06-181810 Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of HSB06-181810 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB06-181810 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. HSB06-181810
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 18 x 18 x 10 mm
Datasheet: HSB06-181810 Datasheet (PDF)
Price (USD)
1: USD 1.2823 ea
Line Total: USD 1.28 
Availability : 921
  
Ship by Wed. 27 Aug to Fri. 29 Aug
QtyUnit Price
1$ 1.2823
10$ 1.0987
25$ 1.0023
50$ 0.9413
100$ 0.9066
250$ 0.8732
500$ 0.8409
1000$ 0.7554
5880$ 0.7542

 HSB06-181810 More Buying Options & Price Grid(s)
Availability 1803
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 56
Multiples : 1
QtyUnit Price
56$ 1.3216
250$ 1.0408
500$ 0.9988
1960$ 0.9174
3920$ 0.8754
5880$ 0.8505
7840$ 0.8334
11760$ 0.7862

Availability 921
Ship by Wed. 27 Aug to Fri. 29 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.2823
10$ 1.0987
25$ 1.0023
50$ 0.9413
100$ 0.9066
250$ 0.8732
500$ 0.8409
1000$ 0.7554
5880$ 0.7542

Specifications

   
Manufacturer
Product Category
Product
Subcategory
Product Type
Type
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB06-181810 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB06-181810 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB06-181810 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB06-181810 23.68 29.1 8.8 6.1 3.17 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 Power Natural 400 LFM 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 29.1 8.8 6.1 2 52.2 17.3 12.0 40 3 72.8 25.8 17.9 4 91.6 34.1 23.6 20 5 109.5 42.6 29.6 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB06-181810 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.7 g cuidevices.com

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Cui Devices may also be referenced as

Same Sky (formerly CUI Devices)

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