X-On Electronics has gained recognition as a prominent supplier of HSB19-272718 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB19-272718 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB19-272718 CUI Devices

Hot HSB19-272718 electronic component of CUI Devices
HSB19-272718 CUI Devices
HSB19-272718 Heat Sinks
HSB19-272718  Thermal Management

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See Product Specifications
Part No. HSB19-272718
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 27 x 27 x 18 mm
Datasheet: HSB19-272718 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
34: USD 2.0837 ea
Line Total: USD 70.85 
Availability - 533
Ship by Tue. 15 Jul to Mon. 21 Jul
MOQ: 34  Multiples: 1
Pack Size: 1
Availability Price Quantity
533
Ship by Tue. 15 Jul to Mon. 21 Jul
MOQ : 34
Multiples : 1
34 : USD 2.0837
250 : USD 1.7194
660 : USD 1.6406
1320 : USD 1.575
2640 : USD 1.5094
5280 : USD 1.4438
7920 : USD 1.4044
10560 : USD 1.3256

1073
Ship by Fri. 11 Jul to Tue. 15 Jul
MOQ : 1
Multiples : 1
1 : USD 2.2837
10 : USD 1.9782
25 : USD 1.7556
50 : USD 1.6978
100 : USD 1.617
250 : USD 1.5939
500 : USD 1.5477
1000 : USD 1.5015
5280 : USD 1.4322

   
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We are delighted to provide the HSB19-272718 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB19-272718 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB19-272718 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB19-272718 11.11 14.7 4.5 3.3 6.75 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 1 14.7 4.5 3.3 40 2 27.8 8.7 5.9 3 39.2 12.9 8.9 20 4 49.6 17.3 11.9 5 59.3 21.7 14.8 0 6 69.0 26.0 17.8 02461357 8191011 2 7 77.7 30.3 20.6 8 86.6 34.8 23.5 Heat Dissipated (W) 9 94.8 39.3 26.5 10 103.4 44.0 29.4 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB19-272718 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 9.1 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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