HSE-B254-04H CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 4 SERIES: HSE-BX-04H DESCRIPTION: HEAT SINK FEATURES TO-220 or TO-218 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B254-04H 25.4 15.96 16.65 4.93 4.13 4.70 HSE-B381-04H 38.1 12.71 12.33 4.44 2.57 5.90 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B254-04H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM Power Natural 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 16.65 4.93 4.13 2 33.54 11.08 8.61 50 3 49.96 17.20 13.23 40 4 65.78 23.50 17.80 30 5 78.65 29.14 21.94 6 92.33 35.03 26.22 20 7 105.77 41.10 30.69 10 8 117.14 46.59 35.07 0 9 127.85 53.10 39.55 01 23 45 6789 10 10 137.37 59.79 44.08 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-04H DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSE-B381-04H 100 Without Airflow Heatsink Temperature Rise Above 90 Ambient (T = Ths - Ta) (C) 200 LFM 400 LFM Power Natural 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 12.33 4.44 2.57 2 26.70 8.40 6.04 50 3 41.68 13.14 9.20 40 4 54.04 17.42 12.44 30 5 66.70 21.73 15.45 6 77.18 26.26 17.85 20 7 86.99 30.62 20.63 10 8 97.85 35.10 24.27 0 9 108.50 39.48 27.54 0123 45 67 8910 10 117.17 44.10 31.21 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)