HSS-B20-095H CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/12/2020 page 1 of 3 SERIES: HSS-B20-05 DESCRIPTION: HEAT SINK FEATURES TO-220 package available with and without solder pins black anodized finish aluminum 1 solder pin thermal resistance power MODEL 1 dissipation orientation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-095H horizontal 9.5 18.34 23.32 6.50 4.48 4.09 HSS-B20-NP-15 no pin -- 18.34 23.32 6.50 4.48 4.09 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 70 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 50 1 23.32 6.50 4.48 40 2 41.07 12.47 8.78 3 58.53 18.87 12.95 30 4 73.99 25.00 17.27 20 5 86.32 30.94 21.52 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-05 DESCRIPTION: HEAT SINK date 02/12/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL5052 tolerance: 0.5 mm FINISH black anodized THICKNESS 0.8 mm HSS-B20-095H: 2.9 g WEIGHT HSS-B20-NP-15: 2.9 g HSS-B20-095H HSS-B20-NP-15 cuidevices.com