Product Information

AT25DF041B-SSHNHR-T

AT25DF041B-SSHNHR-T electronic component of Dialog Semiconductor

Datasheet
NOR Flash 4 Mbit, Wide Vcc (1.7V to 3.6V), -40 C to 125 C, SOIC-N 150mil (Tape & Reel), Single, Dual SPI NOR flash

Manufacturer: Dialog Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.3735 ea
Line Total: USD 2.37

6765 - Global Stock
Ships to you between
Mon. 03 Jun to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4851 - WHS 1


Ships to you between Mon. 03 Jun to Wed. 05 Jun

MOQ : 1
Multiples : 1

Stock Image

AT25DF041B-SSHNHR-T
Dialog Semiconductor

1 : USD 1.7068
10 : USD 1.5822
100 : USD 1.4078
500 : USD 1.3829
1000 : USD 1.3331
2000 : USD 1.2707
4000 : USD 1.2396
8000 : USD 1.2048
24000 : USD 1.1698

     
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AT25DF041B 4-Mbit, 1.7V-3.6V Minimum SPI Serial Flash Memory DATASHEET (ADDENDUM) High Temperature Operation (125C) This data sheet addendum is to be used in conjunction with the existing AT25DF041B datasheet specifications. The Adesto AT25DF041B 4Mbit Serial Flash devices will operate 125C with the following datasheet caveats. All other parameters will meet the existing datasheet specifications. The ordering code suffix (CAN Code) HR or HT must be used to ensure correct operation at this extended temperature range. Adesto will not modify and republish the current datasheet to reflect the CAN ordering code or the above caveats. The standard AT25DF041B datasheet is available at 2. Ordering Code 2.1 Green Package Options (Pb/Halide-free/RoHS Compliant) Max. Freq. (1) Ordering Code Package Operating Voltage (MHz) Operation Range AT25DF041B-SSHNHR-T 8S1 AT25DF041B-SSHNHR-B AT25DF041B-XMHNHR-T 8X Extended AT25DF041B-XMHNHR-B 1.7V to 3.6V 85MHz (-40C to +125C) AT25DF041B-MAHNHR-T 8MA3 (2) AT25DF041B-DWFHT DWF (3) AT25DF041B-UUNHR-T 8-WLCSP 1. The shipping carrier option code is not marked on the devices. 2. Contact Adesto for mechanical drawing or Die Sales information. 3. Contact Adesto for WLCSP availability and lead time. Handle product in accordance with UV and ESD precautions. Package Type 8S1 8-lead, 0.150 Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8X 8-lead, Thin Shrink Small Outline Package 8MA3 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) DWF Die in Wafer Form 8-WLCSP 8-ball, 3 x 2 x3mm Ball Matrix, 0.35mm Z-Height 3. Revision History Revision Level Release Date History A January 2015 Initial release. Added WLCSP package. Corrected units specification for I and t . Removed UDPD CSH B November 2015 preliminary package note. C August 2017 Updated corporate address information.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
ADESTO
Adesto Technologies
Dialog Semiconductor GmbH
DLG
Echelon / Adesto
Echelon Corporation

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