Following the acquisition of Adesto Technologies, Dialog Semiconductor offers memory products as part of its product portfolio. The existing content from datasheets, including part numbers and codes should be used. Terms of Purchase are provided on the Dialog website DATASHEET AT25SL321 32-Mbit, 1.7 V Minimum SPI Serial Flash Memory with Dual I/O, Quad I/O and QPI Support Features Single 1.7 V - 2.0 V Supply Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible - Supports SPI Modes 0 and 3 - Supports Dual Output Read and Quad I/O Program and Read - Supports QPI Program and Read - 104 MHz Maximum Operating Frequency - Clock-to-Output (t ) of 6 ns V1 - Up tp 65 Mbytes/s continuous data transfer rate Full Chip Erase Flexible, Optimized Erase Architecture for Code and Data Storage Applications - 0.6 ms Typical Page Program (256 bytes) Time - 60 ms Typical 4 kbyte Block Erase Time - 200 ms Typical 32 kbyte Block Erase Time - 300 ms Typical 64 kbyte Block Erase Time Hardware Controlled Locking of Protected Blocks via WP Pin 4 kbit secured One-Time Programmable Security Register Hardware Write Protection Serial Flash Discoverable Parameters (SFDP) Register Flexible Programming - Byte/Page Program (1 to 256 bytes) - Dual or Quad Input Byte/Page Program (1 to 256 bytes) - Accelerated programming mode via 9V ACC pin Erase/Program Suspend and Resume JEDEC Standard Manufacturer and Device ID Read Methodology Low Power Dissipation - 2 A Deep Power-Down Current (Typical) - 10 A Standby current (Typical) - 5 mA Active Read Current (Typical) Endurance: 100,000 program/erase cycles (4, 32, or 64 kbyte blocks) Data Retention: 20 Years Industrial Temperature Range: -40 C to +85 C Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options - 8S4, 8-lead SOIC (208-mil) - 8MA1, 8-pad UDFN (6 x 5 x 0.6 mm) - 8MA2, 8-pad USON(3 x 4 x 0.55 mm) - 8S1, 8-lead SOIC (150 mil) - 8-ball WLCSP, die Ball Grid Array (dBGA) DS-25SL321112H10/2020