REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A 87-05-26 N. A. Hauck Add vendor 07263. Change P max from 275 mW to 303 mW. Change I from D CC 50 mA to 55 mA. Change footnote 2, page 5. B Changes IAW NOR 5962-R153-93. Table I, add footnote 3/ in maximum clock 93-05-05 Monica L. Poelking frequency, symbol column. Table I, add footnote at the end of table,3/ f , if MAX not tested, shall be guaranteed to the specified limits Editorial changes throughout. - tvn C Update to reflect latest changes in format and requirements. Editorial changes 02-02-27 Raymond Monnin throughout. - les D Update drawing to current requirements. Editorial changes throughout. - gap 09-04-02 Joseph D. Rodenbeck CURRENT CAGE CODE IS 67268 The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86071 01 C X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F164 8-bit serial-in parallel-out shift register 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or GDIP2-T14 14 Dual-in-line package D GDFP1-F14 or GDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A 1.3 Absolute maximum ratings Supply voltage range .......................................................................... -0.5 V dc to +7.0 V dc Input voltage range ............................................................................ -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range.................................................................. -65C to +150 C Maximum power dissipation (P ) per device 1/ ................................ 303 mW D Lead temperature (soldering, 10 seconds) ........................................ +300 C Thermal resistance, junction-to-case ( ) ........................................ See MIL-STD-1835 JC Junction temperature (T ) .................................................................. +175 C J 1.4 Recommended operating conditions. Supply voltage range (V ) ................................................................ +4.5 V dc minimum to +5.5 V dc maximum CC ) ............................................... 2.0 V dc Minimum high level input voltage (VIH Maximum low level input voltage (V ) ............................................... 0.8 V dc IL Case operating temperature range (T ) ............................................ -55 C to +125 C C Setup time, high or low, A or B to CP ............................................... 7 ns minimum Hold time, high or low, A or B to CP .................................................. 1 ns minimum Clock pulse width high ....................................................................... 4 ns minimum Clock pulse width low ........................................................................ 7 ns minimum MR pulse width low .......................................................................... 7 ns minimum Recovery time, MR to CP ................................................................. 9 ns minimum 1/ Must withstand the added P due to short circuit test (e.g. I ). D OS SIZE STANDARD 5962-86071 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97