5962-8761201DA(NSC) E2v

5962-8761201DA(NSC) electronic component of E2v Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of 5962-8761201DA(NSC) across the USA, India, Europe, Australia, and various other global locations. 5962-8761201DA(NSC) are a product manufactured by E2v. We provide cost-effective solutions for 5962-8761201DA(NSC), ensuring timely deliveries around the world.

Part No. 5962-8761201DA(NSC)
Manufacturer: E2v
Category: Unclassified
Description: AC02/C NSC DIE - FP
NSC: Processor for X-ray imaging systems with digital readout.
Datasheet:
Price (USD)
1: USD 194.4629 ea
Line Total: USD 194.46 
Availability : 0
  
QtyUnit Price
1$ 194.4629
10$ 167.0351
50$ 158.6839
100$ 105.7929
250$ 90.678
500$ 79.3474

Availability 0
Ship by Mon. 13 Oct to Fri. 17 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 194.4629
10$ 167.0351
50$ 158.6839
100$ 105.7929
250$ 90.678
500$ 79.3474

   
Manufacturer
Product Category
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We are delighted to provide the 5962-8761201DA(NSC) from our E2v manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 5962-8761201DA(NSC) and other electronic components in the E2v manufacturer and beyond.

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1. 5962-8761201DA is a National Stock Number (NSN) assigned to a component made by E2v Technologies. 2. It is a Chip-Carrier packaged LSI (Large Scale IC) module, which incorporates multiple Integrated Circuits (IC's) and other components on one module. 3. This particular component is categorized in the Electronic-Components category, and is also referred to as an Application/Programmable Specific Standard Product (ASSP). 4. It is designed to minimize board space and reduce operating power while providing high performance by incorporating select chips and components that are optimized for a specific application. 5. The component has the following main features: Field-Programmable Gate Array (FPGA) support, up to 20 I/O pins per package, current sharing between terminals, power-on reset, integrated clock blocks, and application-specific integrated circuits.

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