REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE number 75569. Add device type 02. Add case outline S. 89-04-25 M. A. Frye Change figure 1 to table form. Editorial changes throughout. B Add vendor CAGE numbers 9Z527 and 27014 for device type 01. Technical 89-12-07 M. A. Frye changes in table I. Editorial changes throughout. C Changes in accordance with NOR 5962-R068-96. 96-03-06 Monica L. Poelking D Incorporate revision C. Update boilerplate changes to MIL-PRF-38535 03-08-26 Thomas M. Hess requirements. Editorial changes throughout. LTG E Add footnote 4/ to I in table I. Update boilerplate paragraphs to 10-03-22 Muhammad A. Akbar CC MIL-PRF-38535 requirements. jak REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Monica L. Poelking 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87630 01 R A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT244 Noninverting octal line driver/buffer with three-state outputs, TTL compatible inputs 02 54FCT244A Noninverting octal line driver/buffer with three-state outputs, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range ........................................................... -0.5 V dc to +6.0 V dc Input voltage range .............................................................. -0.5 V dc to V + 0.5 V dc CC Output voltage range ............................................................ -0.5 V dc to V + 0.5 V dc CC DC input diode current (I ) ................................................... -20 mA IK DC output diode current (I ) ............................................... -50 mA OK DC output current ................................................................. 100 mA Maximum power dissipation (P ) 2/ .................................... 500 mW D Thermal resistance, junction-to-case ( ) ........................... See MIL-STD-1835 JC Storage temperature range .................................................. -65C to +150 C Junction temperature (T ) ..................................................... +175C J Lead temperature (soldering, 10 seconds) ........................... +300C 1.4 Recommended operating conditions. Supply voltage range (V ) .................................................. +4.5 V dc to +5.5 V dc CC Maximum low level input voltage (V ) .................................. 0.8 V dc IL Minimum high level input voltage (V ) ................................. 2.0 V dc IH Case operating temperature range (T ) ............................... -55C to +125 C C 1/ All voltages referenced to GND. 2/ Must withstand the added P due to short circuit test e.g., I . D OS SIZE STANDARD 5962-87630 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 E 2 DSCC FORM 2234 APR 97