WS57C71C-55TMB(ST) E2v

WS57C71C-55TMB(ST) electronic component of E2v Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of WS57C71C-55TMB(ST) across the USA, India, Europe, Australia, and various other global locations. WS57C71C-55TMB(ST) are a product manufactured by E2v. We provide cost-effective solutions for WS57C71C-55TMB(ST), ensuring timely deliveries around the world.

Part No. WS57C71C-55TMB(ST)
Manufacturer: E2v
Category: Unclassified
Description: WS57C71C-55TMB(ST)
ST WS57C71C-55TMB image sensor for mobile camera with 55MP and 1.55µm pixel.
Datasheet:
Price (USD)
1: USD 467.3785 ea
Line Total: USD 467.38 
Availability : 0
  
QtyUnit Price
1$ 467.3785
10$ 420.6384
25$ 373.9086
100$ 354.2292

Availability 0
Ship by Fri. 26 Sep to Thu. 02 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 467.3785
10$ 420.6384
25$ 373.9086
100$ 354.2292

   
Manufacturer
Product Category
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We are delighted to provide the WS57C71C-55TMB(ST) from our E2v manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the WS57C71C-55TMB(ST) and other electronic components in the E2v manufacturer and beyond.

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WS57C71C-55TMB is a 42-channel static random access memory (SRAM) module from E2V. It is a 32-bit, 5V device with 55 nanosecond access time. The module comes in a pin-and-socket configuration and is available in both plastic and ceramic packages. It has multiple input/output bus control and refresh capabilities. The module is suitable for use in embedded systems where fast access is needed. Additionally, the module provides power savings due to its low power consumption.

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