Product Information

EMD4E001G16G2-150CAS2

EMD4E001G16G2-150CAS2 electronic component of Everspin

Datasheet
MRAM 1Gb Non-Volatile ST-DDR4 Spin-transfer Torque MRAM

Manufacturer: Everspin
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

380: USD 135.1956 ea
Line Total: USD 51374.33

0 - Global Stock
MOQ: 380  Multiples: 380
Pack Size: 380
Availability Price Quantity
0 - Warehouse 1


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 380
Multiples : 380
380 : USD 118.2775
570 : USD 115

     
Manufacturer
Product Category
Package / Case
Memory Size
Organisation
Access Time
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
MR4A08BYS35 electronic component of Everspin MR4A08BYS35

MRAM 16Mb 3.3V 35ns 2Mx8 Parallel MRAM
Stock : 220

MR0A16ACMA35 electronic component of Everspin MR0A16ACMA35

MRAM 1Mb 3.3V 64Kx16 35ns Parallel MRAM
Stock : 659

MR0A16AVYS35 electronic component of Everspin MR0A16AVYS35

Memory; MRAM; parallel 16bit; 64kx16bit; 1Mbit; 35ns; TSOP44 II
Stock : 675

MR4A16BCMA35 electronic component of Everspin MR4A16BCMA35

MRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM
Stock : 209

MR25H256MDF electronic component of Everspin MR25H256MDF

MRAM 256Kb 3.3V 32Kx8 SPI
Stock : 1

MR4A08BCMA35 electronic component of Everspin MR4A08BCMA35

NVRAM MRAM Parallel 16Mbit 3.3V 48-Pin FBGA Tray
Stock : 596

MR2A16AMYS35 electronic component of Everspin MR2A16AMYS35

MRAM 4MB 3.3V 35ns 512K x 8 MRAM
Stock : 336

MR25H128ACDF electronic component of Everspin MR25H128ACDF

MRAM 128Kb 3.3V 16Kx8 SPI
Stock : 742

MR5A16AYS35 electronic component of Everspin MR5A16AYS35

MRAM
Stock : 68

MR3A16AMA35 electronic component of Everspin MR3A16AMA35

MRAM
Stock : 0

Image Description
MR4A08BYS35 electronic component of Everspin MR4A08BYS35

MRAM 16Mb 3.3V 35ns 2Mx8 Parallel MRAM
Stock : 220

MR0A16ACMA35 electronic component of Everspin MR0A16ACMA35

MRAM 1Mb 3.3V 64Kx16 35ns Parallel MRAM
Stock : 659

MR0A16AVYS35 electronic component of Everspin MR0A16AVYS35

Memory; MRAM; parallel 16bit; 64kx16bit; 1Mbit; 35ns; TSOP44 II
Stock : 675

MR4A16BCMA35 electronic component of Everspin MR4A16BCMA35

MRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM
Stock : 209

MR25H256MDF electronic component of Everspin MR25H256MDF

MRAM 256Kb 3.3V 32Kx8 SPI
Stock : 1

MR4A08BCMA35 electronic component of Everspin MR4A08BCMA35

NVRAM MRAM Parallel 16Mbit 3.3V 48-Pin FBGA Tray
Stock : 596

MR2A16AMYS35 electronic component of Everspin MR2A16AMYS35

MRAM 4MB 3.3V 35ns 512K x 8 MRAM
Stock : 336

MR25H128ACDF electronic component of Everspin MR25H128ACDF

MRAM 128Kb 3.3V 16Kx8 SPI
Stock : 742

MR3A16AMA35 electronic component of Everspin MR3A16AMA35

MRAM
Stock : 0

AS3032316-035nX0IBCY electronic component of Avalanche Technology AS3032316-035nX0IBCY

MRAM Avalanche Asynchronous Parallel interface P-SRAM 32Mb in FBGA48 package with x16 interface, 3V, -40 C to 85 C
Stock : 0

EMD4E001GAS2 FEATURES 1Gb Non-Volatile ST-DDR4 Spin-transfer Torque MRAM 128Mb x8, 64Mb x16 Organization Supports most DDR4 features Page size of 1024 bits for x8, 2048 bits for x16 VDD = VDDQ = 1.2v VPP = 2.5V Operating Temperature of 0C to 85 C 667MHz clock frequency (fCK) On-Device Termination Multipurpose register READ and WRITE capability Per-Device addressability (PDA) Connectivity Test On-Chip DLL aligns DQ, DQS, DQS transition with CK transition Burst lengths of 8 addresses All addresses and control inputs are latched on rising edge of the clock -11 Bit Error Rate (BER) = 1 x 10 Data Retention = 3 months at 70C 10 Cycle Endurance = 1 x 10 Standard FBGA package options (Pb-free): 78-ball (10mm x 13mm) package (x8) 96-ball (10mm x 13mm) package (x16) Timing cycle time: 1.5ns CL = 10 (ST-DDR4 1333) 1.5ns CWL = 9 (ST-DDR4 1333) 2020 Everspin Technologies 1 EMD4E001GAS2 Revision 1.2 08/2020 All Rights Reserved EMD4E001GAS2 TABLE of CONTENTS 1. CONVENTIONS, DEFINITIONS AND COPYRIGHTS .................................................................... 10 1.1 Signal Naming Convention ............................................................................................. 10 1.2 Device Pin Signal Level ................................................................................................... 10 1.3 Bus Signal Level .............................................................................................................. 10 2. FUNCTIONAL DESCRIPTION .................................................................................................... 11 3. ST-DDR4 SPECIFICATION ENHANCEMENTS, DEVIATIONS & UNSUPPORTED OPTIONS ......... 11 4. SIMPLIFIED STATE DIAGRAM .................................................................................................. 17 5. FUNCTIONAL BLOCK DIAGRAM .............................................................................................. 19 5.1 Available Speed Bins ...................................................................................................... 21 5.2 Addressing Scheme ........................................................................................................ 21 6. PACKAGING and SIGNAL DESCRIPTIONS ................................................................................. 22 7. ELECTRICAL SPECIFICATIONS .................................................................................................. 27 7.1 Absolute Maximum Ratings ........................................................................................... 27 7.2 Operating Temperature Range ...................................................................................... 28 7.3 AC/DC OPERATING CONDITIONS ................................................................................... 28 7.4 VREFCA Supply ............................................................................................................... 29 7.5 V Supply and Calibration Ranges ............................................................................ 30 REFDQ 7.6 VREFDQ Ranges .............................................................................................................. 30 7.7 SPEED BIN OPERATING CONDITIONS ............................................................................. 32 8. I , I AND I SPECIFICATION PARAMETERS ....................................................................... 33 DD PP DDQ 8.1 Current Specifications Patterns and Test Conditions .................................................. 33 9. ELECTRICAL CHARACTERISTICS AND AC TIMING PARAMETERS ............................................. 50 10. POWER UP INITIALIZATION SEQUENCE .................................................................................. 59 10.1 Default Values ................................................................................................................ 59 10.2 Power Up Initialization Sequence .................................................................................. 59 10.3 Reset with Stable Power ................................................................................................ 62 10.4 Uncontrolled Power Down Sequence ............................................................................ 63 11. MODE REGISTERS .................................................................................................................... 63 11.1 Programing the Mode Registers .................................................................................... 63 11.2 Mode Register Structure ................................................................................................ 66 11.3 MPR Reads...................................................................................................................... 75 11.4 MPR Readout Format ..................................................................................................... 76 11.5 MPR Readout Serial Format ........................................................................................... 76 2020 Everspin Technologies 2 EMD4E001GAS2 Revision 1.2 08/2020 All Rights Reserved

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
Everspin Tech
Everspin Technologies

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted