GD25D05CTIG Gigadevice

GD25D05CTIG electronic component of Gigadevice
GD25D05CTIG Gigadevice
GD25D05CTIG NOR Flash
GD25D05CTIG  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of GD25D05CTIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. GD25D05CTIG NOR Flash are a product manufactured by Gigadevice. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. GD25D05CTIG
Manufacturer: Gigadevice
Category: NOR Flash
Description: NOR Flash 512Kbit NOR Flash /3.3V /SOP8 150mil /Industrial(-40? to +85?) /Tube
Datasheet: GD25D05CTIG Datasheet (PDF)
Price (USD)
20000: USD 0.1991 ea
Line Total: USD 3982 
Availability : 0
  
QtyUnit Price
20000$ 0.1991

Availability 0
Ship by Tue. 18 Nov to Thu. 20 Nov
MOQ : 20000
Multiples : 20000
QtyUnit Price
20000$ 0.1991

   
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We are delighted to provide the GD25D05CTIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GD25D05CTIG and other electronic components in the NOR Flash category and beyond.

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3.3V Uniform Sector Standard and Dual Serial Flash GD25D10C/05C GD25D10C/05C DATASHEET 1 3.3V Uniform Sector Standard and Dual Serial Flash GD25D10C/05C CONTENTS 1. FEATURES ................................................................................................................................................................ 4 2. GENERAL DESCRIPTION ..................................................................................................................................... 5 3. MEMORY ORGANIZATION .................................................................................................................................. 7 4. DEVICE OPERATION ............................................................................................................................................. 8 5. DATA PROTECTION ............................................................................................................................................... 9 6. STATUS REGISTER ............................................................................................................................................... 10 7. COMMANDS DESCRIPTION............................................................................................................................... 11 7.1. WRITE ENABLE (WREN) (06H) ......................................................................................................................... 13 7.2. WRITE DISABLE (WRDI) (04H) ......................................................................................................................... 13 7.3. READ STATUS REGISTER (RDSR) (05H) ............................................................................................................. 13 7.4. WRITE STATUS REGISTER (WRSR) (01H) .......................................................................................................... 14 7.5. READ DATA BYTES (READ) (03H)..................................................................................................................... 15 7.6. READ DATA BYTES AT HIGHER SPEED (FAST READ) (0BH) ................................................................................ 15 7.7. DUAL OUTPUT FAST READ (3BH) ...................................................................................................................... 16 7.8. PAGE PROGRAM (PP) (02H) ................................................................................................................................ 16 7.9. SECTOR ERASE (SE) (20H) ................................................................................................................................. 17 7.10. 32KB BLOCK ERASE (BE) (52H) ....................................................................................................................... 18 7.11. 64KB BLOCK ERASE (BE) (D8H) ...................................................................................................................... 18 7.12. CHIP ERASE (CE) (60/C7H)................................................................................................................................ 19 7.13. DEEP POWER-DOWN (DP) (B9H) ....................................................................................................................... 19 7.14. RELEASE FROM DEEP POWER-DOWN / READ DEVICE ID (ABH) ........................................................................ 20 7.15. READ MANUFACTURE ID/ DEVICE ID (REMS) (90H) ........................................................................................ 21 7.16. READ IDENTIFICATION (RDID) (9FH) ................................................................................................................ 21 8. ELECTRICAL CHARACTERISTICS .................................................................................................................. 23 8.1. POWER-ON TIMING ....................................................................................................................................... 23 8.2. INITIAL DELIVERY STATE ............................................................................................................................ 23 8.3. ABSOLUTE MAXIMUM RATINGS ............................................................................................................... 23 8.4. CAPACITANCE MEASUREMENT CONDITIONS ........................................................................................ 24 8.5. DC CHARACTERISTICS................................................................................................................................. 25 8.6. AC CHARACTERISTICS................................................................................................................................. 28 9. ORDERING INFORMATION ............................................................................................................................... 32 9.1. VALID PART NUMBERS ........................................................................................................................................ 33 10. PACKAGE INFORMATION ............................................................................................................................. 35 10.1. PACKAGE SOP8 150MIL .................................................................................................................................... 35 10.2. PACKAGE SOP8 208MIL .................................................................................................................................... 36 10.3. PACKAGE TSSOP8 173MIL ............................................................................................................................... 37 10.4. PACKAGE DIP8 300MIL ..................................................................................................................................... 38 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
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