X-On Electronics has gained recognition as a prominent supplier of W25Q256JVBIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q256JVBIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q256JVBIQ Winbond

W25Q256JVBIQ electronic component of Winbond
W25Q256JVBIQ Winbond
W25Q256JVBIQ NOR Flash
W25Q256JVBIQ  Semiconductors

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See Product Specifications
Part No. W25Q256JVBIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector
Datasheet: W25Q256JVBIQ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 3.6881 ea
Line Total: USD 3.69 
Availability - 312
Ship by Mon. 02 Jun to Wed. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
312
Ship by Mon. 02 Jun to Wed. 04 Jun
MOQ : 1
Multiples : 1
1 : USD 3.6881
10 : USD 3.1757
25 : USD 2.8759
100 : USD 2.7951
480 : USD 2.6565
5280 : USD 2.6334

   
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We are delighted to provide the W25Q256JVBIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q256JVBIQ and other electronic components in the NOR Flash category and beyond.

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W25Q256JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: August 03, 2017 Revision G W25Q256JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI Operations ................................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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